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Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity

05/14/2025 | BUSINESS WIRE
Corning Incorporated, a world leader in glass science and optical physics, today announced a collaboration with Broadcom Incorporated, a leading supplier in the semiconductor field, on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers.

Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand

05/13/2025 | Prashant Patel -- Column: Facing the Future
Innovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.

DENSO, ROHM Reach Basic Agreement to Establish a Strategic Partnership in the Semiconductor

05/12/2025 | DENSO
DENSO CORPORATION and ROHM Co., Ltd. are pleased to announce that the two companies have reached a basic agreement to establish a strategic partnership in the semiconductor field. This agreement follows discussions and considerations that began in September 2024.

Baker Hughes' Waygate Unveils Nanotom HR for Advanced Inspection

05/06/2025 | Baker Hughes
Waygate Technologies, a Baker Hughes business and global leader in nondestructive testing (NDT) solutions for industrial inspection, unveiled its new extremely high-resolution computed tomography (CT) system, Phoenix Nanotom® HR (High Resolution) at the Control 2025 show in Stuttgart, Germany.

Elephantech, Logitech Together Drive Disruptive Electronics Innovation

05/01/2025 | Elephantech
Elephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
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