Powering the Future: How Packaging Choices Make or Break Performance
Nolan’s Notes: Our Spotlight on Europe
Learning with Leo: Interpreting IPC Soldering Requirements and Acceptance Criteria
Cicor Successfully Completes Acquisition of TT Electronics IoT Solutions Ltd.
April 3, 2024 | CicorEstimated reading time: 1 minute
The Cicor Group has successfully completed the acquisition of TT Electronics IoT Solutions Ltd. with three production sites in the UK and China.
The combination of the sites acquired from TT Electronics PLC with the Cicor companies Axis Electronics (integration 2021) and STS Defence (integration 2024), will create the new leader in the UK EMS market and in addition make Cicor a European market leader in the production of high-end electronics for aerospace and defence applications. With this transaction Cicor has taken another step forward in implementing its strategy to become the European leader in electronics manufacturing services for medical technology, industry, aerospace and defence.
TT Electronics IoT Solutions Ltd. employs more than 500 people at its sites in Hartlepool and Newport in the UK and Dongguan in China and has a total production area of around 25,000 square meters. In the last financial year, sales of GBP 70.2 million were achieved by the acquired entities with a mid-single-digit operating margin (adjusted EBITDA). Cicor expects that after completion of the integration process, the EBITDA margin of the acquired businesses will be raised to a level close to the rest of the Cicor Group. The acquired UK production sites provide the much-needed growth reserves for local production. The production site in Dongguan will be integrated into the Cicor Group's Asian production network.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Benmayor Group to Exhibit PCB Automation and Thermal Management Solutions at APEX EXPO 2026
03/10/2026 | AismalibarBenmayor Group will present PCB automation systems and thermal management materials at APEX EXPO 2026, March 17–19 at the Anaheim Convention Center in Anaheim, California.
Myrias Optics Secures $2.1M Seed Funding to Advance Wafer-Level Metaoptics
02/25/2026 | PRNewswireMyrias Optics, a world leader in wafer-level metaoptics and diffractive optical technologies, announced the closing of a $2.1 million Seed 1 financing round in January 2026.
TTCI Brings Real-World Test Engineering to the 2026 APEX EXPO
02/17/2026 | TTCIThe Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, will exhibit at the 2026 APEX EXPO, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California.
From Aspiration to Acceleration: How IEMI Reflects India’s Electronics Growth
02/17/2026 | Sanjay Huprikar, Chief Global Officer, Global Electronics AssociationIn 2022, the Global Electronics Association’s team in India launched Integrated Electronics Manufacturing & Interconnections (IEMI) as a humble yet aspirational vision for India to become a vital community connector between global supply chains and regional electronics manufacturing ecosystems. Fast forward to January 2026, and a lot has certainly happened in the macro-sense within four lightning quick years. Against this immense backdrop of progress, the fourth edition of IEMI, held in Bangalore on Jan. 29–30, was attended by 1,600 delegates, including 100 from 15 countries outside India representing Asia, Europe, Africa, North America, and Australia.
EIPC Winter Conference Review: A Focus on Miniaturization
02/12/2026 | Pete Starkey, I-Connect007The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.