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Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
April 3, 2024 | InsulectroEstimated reading time: 6 minutes
Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
Its 1800 sqft megabooth will be configured as a Technology Village with “store fronts” occupied by suppliers and a “Town Square,” that is home to PowerChats™.
Michelle Walsh, Insulectro Vice President of Product Management, is pleased with the enthusiastic response of suppliers as “storekeepers” in the Insulectro exhibit.
“This is an exciting year for Insulectro at IPC. Our Technology Village is bursting with new and old suppliers eager to engage attendees to talk about products, services, and new technologies,” Walsh commented.
“Visitors to our space will be welcomed by EMC Arlon, DuPont, Kyocera, and Pacothane in addition to FOCUSTECH™, InduBond®, EMD Electronics, and TADCO. LCOA and CAC will also be featured,” Walsh continued.
And the Technology Village storekeepers extend their welcomes:
Jason Maupin, President/Chief Operating Officer for Arlon Materials Group: “EMC has become the largest manufacturer and supplier of Halogen free CCL materials. These materials are designed for very complex PCBs, such as, for example, Any layer, mSAP, IC substrate, high layer count (HLC)/ high speed digital (HSD) and radio frequency (RF) products just to name a few.”
“Arlon is a global leader in high performance thermoset substrates for mission critical printed circuit boards manufactured for high endurance and long-life programs. Arlon is recognized for the highest quality standards in the industry and is positioned to support our customers most technological challenges through innovating technologies.”
Anthony Rardin, West Commercial Leader, Laminates, Interconnect Solutions for DuPont: “DuPont Interconnect Solutions is showcasing its innovative product range at the upcoming 2024 IPC APEX Expo, with the Pyralux® ML Series being a key highlight.
“This series of laminates contains metal alloys and copper foils that provide essential thermal resistance, thermal conductivity, and resistivity for high-reliability applications.
“Alongside Pyralux® ML is a full range of advanced solutions, including electroplating chemistries including the newest, Silveron™ GT-210 Durable Silver, all-polyimide copper-clad flexible laminates, acrylic-based solutions, Riston® advanced dry film photoresists, and Interra® thin copper-clad laminates for embedded-capacitance materials.
“Visitors to the DuPont booth can explore these options and engage with product experts to create custom solutions to meet their unique needs.”
Uwe Heinrich, Global Sales Manager – Micro Industrial and Printed Circuit Board Tools for Kyocera: “Kyocera welcomes all visitors of the Insulectro booth (# 3306) to take a closer look at our technology & innovation center on display at the IPC APEX EXPO. For the upcoming event, Kyocera presents its impressive engineering and micro-tooling capabilities, highlighting improvements in tool precision and surface finishing technology.
“Visitors will be able to take a close look at:
- Premium PCB tooling for drilling, routing, end milling, scoring/engraving & countersinking
- Specialized PCB & MIT solutions for maximum productivity
- Complex and ultra-micro solid carbide tools with manufacturing ability of < 0.002” or 50µm!
- Highest precision tooling with flute concentricity and radius tolerances of up to 5 µm!
“As an ISO 9001:2015, ISO 14001 & ISO 4501 certified manufacturer with a Six Sigma black belt in manufacturing technology, Kyocera highlights its SPC and lab benchmarking abilities at the expo.
“Plus, our PowerChats™ on the topics of Flex Drilling & Milling, Advanced Materials and HDI and Kyocera’s advanced PCB & MIT tooling expertise will complete Kyocera’s contribution to IPC APEX EXPO.”
Victor Lazaro Gallego, CEO/CTO for InduBond™ Technologies: “We are in the XXI century where technology and energy efficiency plays a crucial role in today's demanding PCB industry.
“At InduBond®, we take this very seriously. Come to our InduBond kiosk inside the Insulectro Technology Village, we will introduce our unique and innovative Xpress induction heating technology that provides high temperature uniformity at a very low energy consumption with a minimal footprint.
“We also will be glad to introduce our layer-to-layer registration and bonding systems, along with a NEW and very wide smart and modular product line of automations to enhance the flexibility and productivity of your lamination department. InduBond is redefining production efficiency and flexibility!!”
Lahcen Khiyaty, Product Development & Technical Manager for Pacothane: “High temperature thermoplastic materials and challenging circuitry patterns have found their way into PCB builds. They have some unique design characteristics as well as applications in flexible circuit technology.
“At our storefront, we will discuss some of Pacothane’s conformal products. Also, our PowerChat™ will detail the attributes of each, benefits and the right selection based on the need of PCB lamination. These PCB laminations will include Rigid Multilayer, Rigid/Flex, Cover-layer Flex, Flexible Multilayer.”
Paul St John, Sales and Distribution Director, Laminating Company of America: “LCOA is the largest supplier of drilling materials used for the manufacture of Printed Circuit Boards in North America. We are the North American leader in PCB drilling materials with worldwide distribution in North America, Europe, and Asia. Our products are manufactured and distributed from our facility found in Lake Forest, CA.
“Our backup and entry drill room products increase yield, ensure accuracy, and enhance reliability for Printed Circuit Board manufacturers whose products go into Internet infrastructure hardware, medical devices, military, and aerospace applications.”
Mark Satchwell, Insulectro Product Manager for Copper Foils: “CAC, Inc is the only manufacturer that bonds all four sides of the copper foil to ensure Foreign Objects and Debris (F.O.D) and not located within the critical surface area of the Printed Circuit Board (PCB) panel.
“As the PCB design requirements increase in complexity the Copper-Aluminum- Copper (CAC) or Copper-Steel-Copper (CSC) options have evolved too. Supporting thinner foils with stocked options down to Qoz (9µm) or thinner as specials along with the Steel layer in CSC’s to enhance induction bonding techniques when using an InduBond press.
“Furthermore, the panels which can included round, or slotted tooling holes are manufactured in a clean-room style environment for maximum cleanliness based on tooling designs.”
James Haley, Head of Strategy & Pathfinding – EMD Electronics: “IPC APEX EXPO allows the interaction between IDM, OEM, and their Fabricators, to meet in one location over several days through open exhibits and educational trainings.
“Working with our trusted supplier Insulectro, we accomplish more together in how we offer our materials and services. Come experience this unique environment – the Technology Village.”
Scott Campbell, President – FOCUSTECH™: “We supply process chemicals and control solutions to printed circuit board fabrication and chemical milling operations. These chemistries are tailored to work effectively with DuPont and other dry film products.
FOCUSTECH™ has a well-established stable of existing products but also prides itself in being able to quickly and effectively formulate custom products for customer specific applications. Insulectro and Focus Tech are your complete source for reliable, high quality process chemicals, control solutions and product support. Come see our working Controller during the show at the Insulectro exhibit #3306.
Robert Wu, General Manager at TADCO: "At TADCO, we take pride in being the leading manufacturer of lamination steel plate and accessories dedicated to serving the circuit board industry. We view ourselves as more than just a supplier but rather a strategic partner in overcoming lamination challenges.
“By fostering open communication, collaboration, and trust, we work closely with our customers to achieve shared goals and drive mutual success."
Michelle Walsh concluded, “Overall, Insulectro and our storekeepers are solution providers for challenges our customers face. Fabricators and OEMs know they can partner with us to meet these challenges with skill, imagination, and, of course, best-in-class materials from our world-class supplier partners.”
All Power Chats are in Space #3306 at IPC APEX EXPO. No sign-up required. For further information, visit our website – www.insulectro.com.
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