The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
SCHMID Group Presents Breakthrough Solutions for Substrate Production at ISES USA
April 9, 2024 | SCHMID GroupEstimated reading time: 1 minute
The SCHMID Group, a global leader in providing solutions to the high-tech electronics, photovoltaics, glass, and energy systems industries participated in the International Semiconductor Executive Summit (ISES) USA this week. As a renowned innovator and technology partner, SCHMID presented groundbreaking insights on solutions for substrate production including organic and glass substrates, as well as details around their embedded trace (ET) process.
In this dynamic session entitled “Solutions for Substrate Production”, Laurent Nicolet, SCHMID Group’s Electronics Vice President, elaborated on the challenges facing traditional organic and next generation glass substrate production and how SCHMID solves these problems for the industry.
Key Highlights:
- Driven by increasing chiplet requirements for high-end performance applications, like AI, new substrate materials and technologies are needed to support miniaturization, integration, performance, thermal management, high frequency capabilities, speed, and energy efficient components and systems.
- SCHMID’s breakthrough ET process opens new design opportunities for next generation substrates that enable manufactures to produce the most advanced substrates below two microns on glass or organics.
- Glass substrates, which exhibit superior thermal and dimensional properties, exceptional dielectric characteristics and capacity for increased chiplet integration, and greater COWOS design flexibility are possible with ET.
- Offering more than 70% of processes and equipment needed, substrate manufacturers can collaborate with a single supplier for both equipment and process solutions to streamline their operations.
Christian Schmid, SCHMID Group Chief Executive Officer, commented “Nicolet’s presentation at ISES USA outlines how our proprietary ET process is at the intersection of next generation innovation, sustainability, and industry transformation alongside our customers. We are pleased with the feedback we received during the event and confident that these technologies will be integrated into future advanced IC-packaging solutions worldwide”.
SCHMID will be exhibiting at the IPC’s Apex/Expo in Annahiem, California, April 9-11, showcasing the latest equipment and process solutions for both UHDI and advanced substrates, including glass with capabilities down to 2 microns and below. See us at booth #4632.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
SCHMID Group Secures Major Orders for AI Server PCB Production Equipment
10/22/2025 | SCHMID GroupSCHMID Group, a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing – announced the successful acquisition of two significant orders in the fast-growing field of PCB for artificial intelligence (AI) server applications. So called AI-Server-Boards.
SCHMID Group Expands Advanced Packaging Portfolio to Power the AI Era
10/14/2025 | EINPresswire.comSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).
SCHMID Ships First InfinityLine P+ Panel-Level Plating System
10/08/2025 | SCHMID GroupSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announced the shipment of its first InfinityLine P+ system – a newly developed panel-level plating equipment with integrated photoresist stripping.
SCHMID Advances Next-Gen Advanced Packaging with New InfinityLine and Glass Core Substrate Solutions
09/29/2025 | SCHMID GroupSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).
SCHMID Group Update on Order Situation and Market Development in 2025
05/22/2025 | SCHMID GroupFollowing a challenging year in 2024, which was particularly affected by the ongoing trade conflict between the USA and China, the SCHMID Group is now experiencing a welcome turnaround. Incoming orders are currently within the expected range, confirming the positive market trend that began to emerge at the end of 2024.