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Paul Cooke of Ventec Talks About Glassless Revolution, High Reliability
April 9, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
Marcy LaRont from I-Connect007 caught up with Paul Cooke from Ventec at the SMTA UHDI Symposium on March 26 in Arizona. Paul discusses the challenges in developing future product lines for extremely high density, high reliability manufacturing, and focuses on the transition from glass to glassless substrate technology. He explains the advantages of using pure resin systems, enabling fabricators to create thinner materials for micro vias.
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