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SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity
April 11, 2024 | SEMIEstimated reading time: 1 minute
SEMI, the industry association serving the global electronics design and manufacturing supply chain, issued the following statement from Ajit Manocha, SEMI President and CEO, after the United States Government announced it will no longer move forward with the Notice of Funding Opportunity for CHIPS funding for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States:
“We recognize that the Department of Commerce was faced with a difficult decision to change course regarding the issuance of a third Notice of Funding Opportunity related to R&D under the CHIPS and Science Act due to recent legislative actions directing the department to make a $3.5 billion investment in secure enclave. While we acknowledge the importance of the underlying objectives guiding recent decisions, we are concerned about their impact on longstanding plans for implementing the CHIPS Act, which was shaped by extensive stakeholder input and industry analysis.”
“Strong investment and support for R&D is essential to advance foundational technologies across the semiconductor supply chain and enhance the overall competitiveness of the U.S. semiconductor industry. Private R&D is the cornerstone of the semiconductor industry, propelling the next generation of innovation. SEMI urges Congress to work alongside the Department of Commerce to fulfill the intent of the CHIPS and Science Act of 2022 to fund private R&D activities under the legislation. Key investments to spur and scale private R&D projects must be paired with support for the National Semiconductor Technology Center (NSTC) to meet the objectives of CHIPS and Science Act and secure the United States’ technological leadership. SEMI stands ready to work with the Department of Commerce and Congress to ensure robust funding for private R&D projects.”
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MegaChips, Acumino Establish Demonstration Environment in Japan
09/17/2025 | BUSINESS WIREMegaChips Corporation and Acumino Inc. are pleased to announce the completion of Japan's first demonstration environment for experiencing Acumino's solutions within MegaChips' premises, signifying a strengthening of their technological collaboration.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).