Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
New Book on Low-temperature Soldering Now Available
April 17, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download. The latest in a series of educational books published by I-Connect007, this book follows up the first volume, published in 2018 and downloaded by thousands.
Peer Reviewer Kevin Byrd, Intel Corporation, offered his recommendation of the book, stating, “This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for low-temperature solder materials.”
Download your free copy today at I-Connect007.com/lts2.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Volume 2.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Unitemp Launches ESPEC Deep Capacity HAST Chamber in UK for Large PCB Testing
03/24/2026 | UnitempA new deep‑capacity Highly Accelerated Stress Test (HAST) chamber capable of accommodating large multilayer PCBs and high specimen volumes is now available in the UK, as Unitemp introduces ESPEC’s latest model, the EHS‑222M‑L.
SEEQC Unveils Integrated Qubit Control Quantum Chip
03/19/2026 | BUSINESS WIRESEEQC announced a significant breakthrough in the development of scalable, chip-based quantum computers, with results published in a peer-reviewed study in Nature Electronics.
Indium Corporation Experts to Present on Array of Solder and Thermal Management Solutions at APEX EXPO 2026
03/12/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics at APEX EXPO 2026, March 17-19, in Anaheim, California.
T-type Thermocouples in Foil Heater Technology
03/12/2026 | Zack Schaner, Flexible Circuit TechnologiesThis article examines the use of T-type thermocouples implemented with flexible printed circuit and etched foil heater technology, focusing on their design, fabrication, and integration into advanced thermal management systems. I’ll give particular attention to how their low-profile construction, accuracy at low temperatures, and mechanical robustness make them well-suited for critical devices operating in demanding environments
Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling
01/29/2026 | Mike Jouppi, Thermal Management LLCDesigners commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.