Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
New Book on Low-temperature Soldering Now Available
April 17, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download. The latest in a series of educational books published by I-Connect007, this book follows up the first volume, published in 2018 and downloaded by thousands.
Peer Reviewer Kevin Byrd, Intel Corporation, offered his recommendation of the book, stating, “This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for low-temperature solder materials.”
Download your free copy today at I-Connect007.com/lts2.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Volume 2.
Share on:
Suggested Items
DELO Introduces UV-approach for Fan-out Wafer-level Packaging
10/25/2024 | DELODELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
10/01/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4
09/25/2024 | I-Connect007 Editorial TeamDirect-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.
Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration
09/24/2024 | Prabjit Singh, Raiyo Aspandiar, Haley Fu, and L. A. SwaminathanNear-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This article will describe the recent significant developments by the iNEMI project team on the understanding of the electromigration behavior of Sn-Bi solder which has a unique physical metallurgy and electromigration behavior quite different for that of Sn-Ag-Cu (SAC) solder and other solders in common use today.