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Phil Kinner Pushes His Limits in Engineering and Running
April 17, 2024 | Linda Stepanich, IPCEstimated reading time: 1 minute

Engineers break things on purpose. They like the challenge of putting things back together and making them stronger and more resilient. The skills engineers use to build products can also be used to rebuild their lives after a personal loss, something Phil Kinner learned when he laced up his running shoes after many years of a sedentary lifestyle.
As an IPC standards development committee member, Phil finds community, connection, and challenges in his work and his hobby of long-distance running. As head of research and development at MacDermid Alpha Polymer Protection and Re-enforcement, Phil oversees polymer product development and R&D to make electronics more reliable.
Meeting Professional Challenges
Phil attended his first IPC APEX EXPO in 1999, sent by his boss for the networking opportunities it offered. He quickly learned that participating in standards development committees allowed him to “be at the forefront of standards and technology development, trying to push things forward, and make things better from a technical point of view,” he says.
Phil appreciates the broad network he’s built as an IPC member. “I wouldn’t have met half the people I’ve met, and my network would not have been anywhere near as good if I hadn’t gotten involved in IPC,” he says. “It’s like the ’phone a friend’ concept on television quizzes—when you need help with electronics questions, you can always find someone in your network to reach out to.”
To read the rest of this article, which appeared in the Spring 2024 issue of IPC Community, click here.
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The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Hardware Engineers, Manufacturing Leaders Ready to ‘Build Better’ Electronics
10/06/2025 | Marcy LaRont, I-Connect007According to Instrumental’s dynamic CEO, Anna-Katrina Shedletsky, the Build Better Electronics Manufacturing Summit on Sept. 30 was a passion project meant to provide a forum for hardware engineering senior leadership, who have very busy jobs and limited opportunities, to share information, thought leadership, and networking opportunities. “Build Better is really about cross-pollination and sharing,” she said, as she highlighted the importance of supporting this type of sharing in tech, which may be more important than ever before.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.
The Road to Reliability: Why EV Electronics Matter More Than Ever
09/16/2025 | Stanton Rak, SF Rak CompanyThe global transition to e-Mobility is redefining the design and reliability expectations of automotive electronics. Unlike their internal combustion engine (ICE) counterparts, EVs operate under "always-on" conditions and are subject to higher voltages, higher currents, and elevated thermal loads. These systems also incorporate exponentially more sensors, control units, and advanced power electronics, often tightly packed in thermally constrained spaces.