Target Condition: Distribution of Power—Denounce the Ounce
Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
Designers Notebook: Power and Ground Distribution Basics
Three Industry Leaders Receive IPC President’s Award
April 17, 2024 | IPCEstimated reading time: 1 minute
In recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, Calif., on April 9, 2024. Recipients were Nick Koop, TTM Technologies, Hiroyuki Watanabe, NEC Corporation, and Dieter Weiss, Weiss Engineering.
Nick Koop was instrumental in the creation of IPC standards that provide specifications for flex and rigid-flex, IPC-2223, and IPC-6013, along with material specifications and test methods. He also contributes to specifications for rigid PCBs, raw materials, final finishes, test methods, and common terminology. He serves as chair of the D-10 Flexible Circuits Committee and D-12 Flexible Circuits Specification Subcommittee and is a member of the Technical Activities Executive Council and the Chairman’s Committee Council.
Hiroyuki Watanabe serves as a member of the IPC Board of Directors and the IPC Thought Leader Program. A lecturer for the IPC engineering webinar series, he also presents webinars to Japan Regional Task Group members. An active participant in the IPC Asia Task Group meetings, Watanabe served as committee chair for the IPC-1792 standard and introduced the significance of that standard at an anti-counterfeiting symposium. He serves on the A-Team “Cyber Key Holder,” and participates in standards committee activities for 2-12A, 2-19A, 2-10, and 2-19C task groups.
Dieter Weiss provides market research on the European EMS industry under the brand in4ma. With IPC’s support, he built a unique database that provides the most qualified benchmarking data available for the EMS industry in Europe. He works on statistical disciplines that enable him to collect data, formulate statistical models, and predict and validate those models using algorithms that involve market segments, company size, and degree of vertical integration to best calculate revenue growth within the industry.
“The leadership and expertise of Nick, Watanabe-san, and Dieter are indispensable to our industry,” said John W. Mitchell, IPC president and CEO. “We show our appreciation for their significant contributions to IPC and the global electronics industry by presenting them with the IPC President’s Award.”
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment
11/04/2025 | Steven Bowles, Lockheed MartinIt’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.