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KYZEN Focuses on Aqueous Cleaning Solutions and Process Monitoring and Control at SMTA Chihuahua Expo and Tech Forum

08/07/2026 | KYZEN
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Chihuahua Expo & Tech Forum scheduled to take place on Thursday, August 20 at Hotel Sheraton Soberano in Chihuahua capital, Chihuahua.

Two KYZEN Aqueous Chemistries and Process Control to Be Featured at SMTA Ohio Valley Expo & Tech Forum

08/06/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Thursday, August 20 at the Embassy Suites by Hilton Cleveland-Rockside in Independence, Ohio.

Why Cleanliness Is a Critical Reliability Driver

06/08/2026 | Mike Bixenman, Magnalytix
As electronic assemblies move toward higher functionality within smaller footprints, design density is increasing quickly. Fine-pitch components, multilayer architectures, and elevated power densities are now standard across industries ranging from automotive to medical and aerospace. While these advancements result in significant performance gains, they also introduce a less visible, but highly consequential, risk: contamination.

Key Considerations When Selecting an Aqueous Cleaning Agent

06/03/2026 | Adam Klett, Ph.D, KYZEN Corporation
Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.

Nolan’s Notes: Cleaning With Smaller Geometries

06/03/2026 | Nolan Johnson -- Column: Nolan's Notes
Cleaning is an under-appreciated, possibly under-considered step in the PCB assembly process. Smaller geometries, combined with increasingly larger bottom-terminated packages for complex components, using ever-smaller pitch sizes, mean that cleaning solutions must drive deeper and rinse out more easily than ever before, and must extract all flux residue and other contaminants.
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