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Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids

07/09/2025 | Happy Holden -- Column: Happy’s Tech Talk
When we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.

Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3

06/25/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Tin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.

Day 1: Cutting Edge Insights at the EIPC Summer Conference

06/17/2025 | Pete Starkey, I-Connect007
The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.

SES’s O3b mPOWER System Receives Platinum Space Sustainability Rating

06/03/2025 | BUSINESS WIRE
O3b mPOWER, SES’s second-generation medium earth orbit (MEO) system, has been awarded the Platinum badge by the Space Sustainability Rating (SSR) Association.

Advint Delivers Advanced Electroplating Training to Triangle Labs 

06/02/2025 | Advint Incorporated
During the last week of April, Advint Incorporated conducted a comprehensive two-day on-site electroplating training session for the technical team at Triangle Labs, Inc., a key innovator in the printed circuit board space. The training was structured to align with the demands of high-reliability plating processes suitable for RF and high-frequency substrates.
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