Nolan's Notes: The Next Killer App in Component Manufacturing
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
ZESTRON Welcomes Angela Marquez as Head of Business Unit, Latin America
April 17, 2024 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is delighted to announce Angela Marquez's appointment as the new Head of the Business Unit for Latin America. Angela Marquez brings a wealth of expertise and insight to her new role. Before joining our team, Angela served as the Business Unit Director for LATAM at Actnano, Inc., where she exhibited exceptional leadership in driving business growth and fostering strategic partnerships.
With an impressive academic background, Angela holds a Master of Business Administration from Nova Southeastern University and a Bachelor of Economics from Pontificia Universidad Javeriana. Her blend of academic achievements and practical experience makes her a formidable leader ready to spearhead ZESTRON's initiatives in the Latin American market.
Angela will collaborate closely with our dedicated ZESTRON Mexico team in her new capacity to bolster support and drive expansion initiatives across the dynamic Latin American market. Her profound understanding of regional dynamics and unwavering commitment to customer satisfaction perfectly align with ZESTRON's vision for growth and excellence.
"I am incredibly excited to join the ZESTRON family and contribute to driving business growth across Latin America,” says Angela. “With ZESTRON's unwavering commitment to excellence and innovation, I am confident that together, we will achieve remarkable success and deliver exceptional value to our regional customers."
Angela's appointment reinforces ZESTRON's dedication to delivering cutting-edge solutions and unparalleled service to clients in Latin America. With her leadership, ZESTRON is poised to seize exciting opportunities and set new benchmarks for regional success.
Share on:
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
Real Time with... IPC APEX EXPO 2025: MKS' Atotech—Leading Innovations in Semiconductor Solutions
03/28/2025 | Real Time with...IPC APEX EXPOIn this interview, Marcy LaRont speaks with Kuldip Johal, CTO, MKS’ Atotech. Based in Boston, MKS operates in vacuum solutions, photonics, and specifically for the Atotech division, material solutions. MKS significantly impacts the semiconductor industry, supplying components for up to 85% of global semiconductor tools and covers processes and materials for 70% of PCB manufacturing steps.
Gold as a Key Component in PCBs and IC Substrates
03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' AtotechGold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.
PCB007 Magazine: The Essential Guide to Surface Finishes—March 2025
03/17/2025 | I-Connect007 Editorial TeamIn the March 2025 issue of PCB007 Magazine, we go back to basics, recount a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore.