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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Two Industry Rising Stars Recognized at IPC APEX EXPO 2024
April 17, 2024 | IPCEstimated reading time: 2 minutes
Two of the industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2024 in recognition of their leadership roles and support of IPC standards, education, advocacy, and solutions to industry challenges. Award recipients were Naim Kapadia and Michael Schleicher.
Naim Kapadia of Grinsty Rail Ltd. has spent more than 20 years in electronics manufacturing working for contract manufacturers and PCB fabricators. He has participated in and led many programs in the UK: disseminating the Montreal Protocol, developing surface mount technology, and implementing lead-free processes. His passion for revolutionizing digital factories for electronic manufacturing led to the development of the first smart factory using legacy equipment in the UK. Naim's demonstration included implementing IPC-CFX, augmented reality/mixed reality, and collaborative robots.
Michael Schleicher of Semikron Elektronik GmbH has more than 30 years of experience in PCB design, contributing to projects in defense, automotive, healthcare, consumer electronics, and other industries. A multidiscipline engineer with Semikron, Michael has won numerous awards, including “Most Challenging High-Speed Design, "FED PCB Design award, the “IEC 1906 Award” and the IPC Golden Gnome “Globetrotter Award” (2023). A member of the FED EV Board and co-founder of the FED Arbeitskreis 3D-Elektronik working group, Schleicher is deeply involved in international standardization activities for IPC and IEC, as well as in the German national committees of DKE and ZVEI. For IPC he serves on the following standards committees: D-31B and D-31B-Creeps-A Team, 5-21N, European Standards Steering Committee, and the IPC APEX 2024 Technical Program Committee.
“We are thrilled to recognize the accomplishments of our Rising Stars and to take this opportunity to thank them for their contributions,” said John W. Mitchell, IPC president and CEO. “We are privileged that Naim and Michael have chosen to share their knowledge and expertise with us and with the entire global electronics manufacturing industry.”
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Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.