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Two Industry Rising Stars Recognized at IPC APEX EXPO 2024
April 17, 2024 | IPCEstimated reading time: 1 minute
Two of the industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2024 in recognition of their leadership roles and support of IPC standards, education, advocacy, and solutions to industry challenges. Award recipients were Naim Kapadia and Michael Schleicher.
Naim Kapadia of Grinsty Rail Ltd. has spent more than 20 years in electronics manufacturing working for contract manufacturers and PCB fabricators. He has participated in and led many programs in the UK: disseminating the Montreal Protocol, developing surface mount technology, and implementing lead-free processes. His passion for revolutionizing digital factories for electronic manufacturing led to the development of the first smart factory using legacy equipment in the UK. Naim's demonstration included implementing IPC-CFX, augmented reality/mixed reality, and collaborative robots.
Michael Schleicher of Semikron Elektronik GmbH has more than 30 years of experience in PCB design, contributing to projects in defense, automotive, healthcare, consumer electronics, and other industries. A multidiscipline engineer with Semikron, Michael has won numerous awards, including “Most Challenging High-Speed Design, "FED PCB Design award, the “IEC 1906 Award” and the IPC Golden Gnome “Globetrotter Award” (2023). A member of the FED EV Board and co-founder of the FED Arbeitskreis 3D-Elektronik working group, Schleicher is deeply involved in international standardization activities for IPC and IEC, as well as in the German national committees of DKE and ZVEI. For IPC he serves on the following standards committees: D-31B and D-31B-Creeps-A Team, 5-21N, European Standards Steering Committee, and the IPC APEX 2024 Technical Program Committee.
“We are thrilled to recognize the accomplishments of our Rising Stars and to take this opportunity to thank them for their contributions,” said John W. Mitchell, IPC president and CEO. “We are privileged that Naim and Michael have chosen to share their knowledge and expertise with us and with the entire global electronics manufacturing industry.”
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TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.