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IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford
April 18, 2024 | IPCEstimated reading time: 1 minute
IPC honored the late Michael Ford, Aegis Software, for his extraordinary contributions to the global electronics manufacturing industry with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. Ford, an industry leader and valued IPC volunteer, died suddenly in January 2024.
Ford is credited as a driving force behind the creation of IPC Connected Factory Exchange, (IPC-CFX), the global standard that simplifies and standardizes machine-to-machine communication while also facilitating machine-to-business and business-to-machine applications.
Ford was the recipient of several IPC awards, including the Hillman-Lambert Award, the IPC President’s Award, the Dieter Bergman Fellowship Award, several Golden Gnome awards, and numerous standards committee leadership and special recognition awards.
“Michael was a visionary,” said John W. Mitchell, IPC president and CEO. “He was not only a gifted, brilliant engineer, but his ability to seek and obtain collaboration gained him loyal friends and colleagues throughout the industry. He was as generous with his knowledge as he was approachable. As many people have said, he shouldered the weight of projects he was involved in, and we owe it to him to carry on the path he generously paved for us. He will be greatly missed.”
Jason Spera, CEO, Aegis Software, accepted the award on behalf of Ford. In his acceptance remarks, Spera had this to say of Ford’s impact upon the electronics industry, “Michael leaves a great legacy of contribution to the electronics industry. That legacy will now be a new step, upon which everything our industry achieves going forward, rises. We can rest assured that this is what Michael hoped for most from his work.”
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Brent Fischthal - Koh YoungSuggested Items
EIPC Technical Snapshot: Sustainability in Electronics Manufacturing
11/06/2025 | Pete Starkey, I-Connect007EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment
11/04/2025 | Steven Bowles, Lockheed MartinIt’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.