-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Scape Technologies Introduces SCAPE CoCreator at Hannover Messe 2024
April 18, 2024 | Scape TechnologiesEstimated reading time: 2 minutes
Today's industrial robotics, 3D Vision, and AI are often confined by costs, complexity, and limited accessibility and usability. Scape Technologies is revolutionizing this field by broadening the horizons of what is possible. At Hannover Messe 2024, Scape Technologies proudly introduce the SCAPE CoCreator, a 3D robot guidance platform that integrates advanced AI and 3D Vision technology with intuitive, no-code robot programming.
A New Era of Automation: Introducing the SCAPE CoCreator Platform
The SCAPE CoCreator platform embodies a leap forward in making robotic automation accessible to a broader audience. It is designed for users of all skill levels, enabling the creation of robotic automation applications without extensive technical know-how and with no-code robot programming. The user-friendly SCAPE CoCreator platform is built upon industry standards, ensuring that developing robust robotic applications is more intuitive than ever.
Our journey from the early days of bin-picking to the creation of this platform signifies our commitment to innovation and leveraging our deep expertise in 3D Vision technology and robotic automation, states René Dencker, CTO of Scape Technologies.
Empowering Industries with SCAPE 3D Scanners
2024 will also see Scape Technologies broaden its horizon with the introduction of the SCAPE 3D scanner family to the European market. At Hannover Messe 2024, Scape Technologies will present the Pro Industrial 3D stationary scanners and a new robot mounted 3D SCAPE Mini Scanner. This development leverages our deep expertise in 3D Vision technology, providing our partners with high-quality, cost-effective 3D vision solutions.
The synergy between SCAPE 3D scanners and the SCAPE CoCreator platform will offer unprecedented value to our customers, states Søren Bøving CEO of Scape Technologies.
Revolutionizing Robot Cells with Cost-Effective Components
In response to the competitive pressures facing European manufacturers, Scape Technologies is set to offer a range of competitively priced components and equipment for building robot cells. This initiative includes SCAPE 3D scanners, SCAPE Vision Controller and other standardized components for a number of complete and standardized SCAPE Robotic Workcells. The first standardized SCAPE Workcell to be introduced will be for loading and unloading of CNC machines, especially lathes handling cylindrical parts.
By integrating these components with our SCAPE 3D scanners and the CoCreator platform, we're setting a new standard for automation solutions, remarks Søren Bøving.
Looking Forward
The SCAPE CoCreator platform not only streamlines the automation process but also opens up new possibilities for innovation through its API, allowing external parties to contribute new functionalities.
This platform represents a significant milestone in our mission to make robotic automation accessible for all, concludes Søren Bøving.
Scape Technologies stands at the forefront of the fourth industrial revolution, empowering companies to imagine, create, and automate with unprecedented ease and efficiency. The launch of the SCAPE CoCreator platform, along with the new range of SCAPE 3D scanners and cost-effective robot cell components, marks a new era of accessibility and innovation in robotic automation.
For more information about Scape Technologies and the SCAPE CoCreator platform, visit our website or join us at Hannover Messe 2024, Hall 8, Stand F10.
Suggested Items
Worldwide Automotive Semiconductor Market to Exceed US$88 Billion by 2027
08/19/2024 | IDCThe global automotive semiconductor market is on track to surpass $88 billion by 2027, driven by the surging demand for high-performance computing (HPC) chips, graphics processing units (GPUs), radar chips, and laser sensors.
PowerCo, QuantumScape Announce Landmark Agreement to Industrialize Solid-State Batteries
07/11/2024 | BUSINESS WIREVolkswagen Group’s battery company PowerCo and QuantumScape (NYSE: QS) today announced they have entered into a groundbreaking agreement to industrialize QuantumScape’s next-generation solid-state lithium-metal battery technology.
IDTechEx Report: Illuminating the Future of Lidar in Automotive
05/09/2024 | PRNewswireIn the rapidly evolving landscape of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, sensor technologies have emerged as a pivotal force driving innovations in the automotive industry.
Aegis Software Leads in IDC’s MarketScape 2023 Vendor Assessments for Manufacturing Execution Systems
05/10/2023 | Business WireAegis Software, a global provider of Manufacturing Operations Management Software, announced it has been recognized by the IDC MarketScape as a Leader in Worldwide High-Tech and Electronics Manufacturing Execution Systems and Worldwide Engineering-Intensive Manufacturing Execution Systems, and recognized as a Major Player in Worldwide Discrete Manufacturing Execution Systems.
Ansys Joins TSMC's OIP Cloud Alliance for Secure Multiphysics Analysis in the Cloud
04/27/2023 | ANSYSAnsys announced that it has joined TSMC's OIP Cloud Alliance to facilitate the deployment of fully distributed workflows for mutual customers. By driving toward the cloud interoperability of Ansys multiphysics solutions with TSMC's technology enablement, customers will easily be able to gain the full benefits of faster run times and elastic computing with major cloud vendors.