Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
April 22, 2024 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries. The advanced system promises to further enhance BitBox's production capabilities by optimising throughput, refining process control, and increase energy efficiency.
With over 25 years working in product design, engineering and manufacturing services, BitBox has consistently prioritised meeting the evolving needs of its customers. Recognising the importance of enhancing its Surface Mount Technology (SMT) reflow oven capabilities to align with growing demand, BitBox conducted a thorough evaluation process. Subsequently, with the help of Altus Group, the Heller 1826 MK7 was chosen as the ideal choice.
"The Heller 1826 MK7 delivers superior reflow oven performance through its extended heated tunnel, additional zones, faster throughput, and precise process controls," said Joe Booth, CEO of Altus Group. "We are pleased to provide this solution to support BitBox's manufacturing expansion."
The Heller 1826 MK7 is engineered to maximize process efficiency and control. Its advanced low Delta T design achieves industry-leading thermal uniformity across 8 heated zones, enabling enhanced product quality while supporting precise profiling within strict process controls. The innovative flux management system incorporates a proprietary flux collection design, trapping residue for safe removal without shutting down the oven.
"We are delighted to have made this investment in upgrading and enhancing our convection reflow capabilities at BitBox," said Jonathan Green, Manufacturing Manager at BitBox. "Heller's reputation as a provider in the industry is outstanding, and we've tailored the system to maximize future-proofing options and deliver significant value to our customer base."
BitBox's investment in the Heller 1826 MK7 addresses key operational challenges and positions the company for continued growth. With increased throughput capacity, optimised uptime, energy efficiency gains, and data-driven quality focus, BitBox can scale up production volumes, maintain stringent quality standards, and realise cost savings through optimised energy efficiency.
"It's been a pleasure to support BitBox every step of the way," added Joe Booth. "Their dedication has been commendable, and I eagerly anticipate the exciting projects ahead with the BitBox team."
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.