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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Real Time with... IPC APEX EXPO 2024: Final Finishes and IC Substrate Manufacturing
April 24, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Editor Marcy LaRont and Richard DePoto, Uyemura's Business Development Manager, engage in a comprehensive discussion about the positive aspects of the show, the benefits of RAIG in final finishes, and the hurdles faced when upgrading your surface finish. Also discussed are the role of Uyemura's MEC pretreatment agents in IC substrate manufacturing and the importance of collaboration and knowledge sharing.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
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Uyemura Expands Northeast Sales Team
01/23/2025 | UyemuraJason Reese has joined Uyemura as Northeast Regional Sales Engineer. Reese was formerly Technical Sales Manager for Metalor Technologies, a manufacturer of precious metal powders. In that capacity, he focused on metallization solutions for semiconductors, and the medical device sector.