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Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
April 25, 2024 | Stanton Rak, SF Rak CompanyEstimated reading time: 1 minute
As a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Webinar: Improving Technical Writing
In a September 2023 workshop on workforce development, I delivered a webinar titled "Technical Paper Writing: Industry Best Practices for Conference Manuscripts." The webinar was prompted by my observations as chair/co-chair of the IPC APEX EXPO Technical Program Committee (TPC) for 2022 and 2023, as well as preparations for ECWC16. TPC members believe there is a need to communicate and document information in a formal and permanent record for the advancement of science and technology. Technical papers add to the credibility of our work so others can truly understand the benefits and advance the field themselves. It is also important that any work presented at IPC APEX EXPO is described in a manner that can be reproduced by others. Additionally, many members of the IPC community are involved with standards task groups and know that high-quality technical papers are often leveraged to help create new and stronger industry standards.
In my leadership role on the TPC, I observed that technical manuscript writing was more prevalent in scientific and academic communities and less so in engineering and industrial environments (where most IPC members reside). I also noted that technical paper writing is in danger of becoming a lost art. In today’s fast-paced world, information is often communicated digitally in brief formats like text messages, posts, and video clips. PowerPoint presentations are useful for conveying information in most professional settings. All these forms of communication serve a valuable purpose: the timely and illustrative dissemination of information. But the quality and breadth of the information can have its limitations.
To read the rest of this article, which appeared in the Spring 2024 issue of IPC Community, click here.
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TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.
Building Industry-ready Talent Through Standards-based Education
04/27/2026 | Global Electronics AssociationRecently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification.
Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
05/04/2026 | Nolan Johnson, I-Connect007This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.