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TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

10/28/2024 | ANSYS
Ansys was recognized at the TSMC 2024 Open Innovation Platform® (OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems.

Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens

10/14/2024 | Bransys
Bransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

09/27/2024 | ANSYS
Ansys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.

Ansys Announces Q2 Financial Results

08/02/2024 | ANSYS
ANSYS, Inc. reported second quarter 2024 revenue of $594.1 million, an increase of 20% and 22% in reported and constant currency, respectively, when compared to the second quarter of 2023. For the second quarter of 2024,

Ansys 2024 R2 Delivers Multiphysics Innovation Across Industries and Engineering Domains

07/29/2024 | ANSYS
Ansys 2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of single-physics simulation to gain multidimensional insight into the performance of today’s complex products. R2 enhancements focused on accelerating run times, scaling capacity, enabling digital transformation, and providing hardware flexibility are making Ansys multiphysics simulations more accessible and powerful than ever before.
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