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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Real Time with… IPC APEX EXPO 2024: Sigma Engineering's Recycling and Regeneration Systems for PCB Etching
May 2, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Evan Howard of Schmoll America interviews Kristoffer Bjorklund, Sigma Engineering's supply chain manager. We learn about Sigma's recycling and regeneration systems for PCB industry etching and the benefits and challenges of implementing these systems in existing factories. The discussion emphasizes the use of an oxidation reactor system and the space efficiency of Sigma's solutions. Trade fairs, roadblocks, and the profitability of their system are also covered.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Suggested Items
SigmaSense Announces Technology Licensing and Co-development with NXP Semiconductors
05/17/2023 | Business WireSigmaSense announced a license and co-development with NXP Semiconductors to lead in the transition from traditional touch interfaces to multi-dimensional sensing capable of revolutionizing user experiences.
Foxconn Leads Funding Efforts for SigmaSense’s Touchscreen Technology
09/24/2020 | Business WireSigmaSense, a global leader in touch screen performance, announced the closing of $22 million in Series A funding led by Foxconn Technology Group with participation from strategic investors Corning, E Ink, GIS and MRI (managing partner of LG-MRI). Former Dell CFO Tom Meredith also participated in the round.