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New Yorker, Major League Electronics Sign New Franchised Distribution Agreement
May 6, 2024 | New Yorker Electronics Co.Estimated reading time: 1 minute
New Yorker Electronics, global distributor of electronic components, recently announced a new franchised distribution agreement with Major League Electronics, renowned manufacturer of interconnect products. Founded in 1993 and located in New Albany, Indiana, USA, Major League Electronics offers an extremely wide range of PCB Connectors including pin headers, Sockets, IDC Cables/connectors and micro connectors for both Board-to-Board and Wire-to-Board applications. They also custom design connectors that can be entirely design specific, and turn them around in a very short lead time.
Major League Electronics is a company that specializes in the design and manufacturing of electronic interconnect products. They offer a wide range of connectors, sockets, and cable assemblies for various industries such as telecommunications, industrial automation, medical devices, and more.
According to Barry Slivka, President of New Yorker Electronics, “Major League Electronics is known for its high-quality products and custom solutions that are tailored to accommodate the specific needs of their customers.” Slivka added, “Major League focuses on providing reliable and durable interconnect solutions for demanding applications.”
Neil Coffman, President of Major League Electronics, commented, “We are excited to have New Yorker Electronics as a distribution partner. We look forward to providing their customers with quality products that meet or exceed their expectations.” As a franchised distributor, New Yorker Electronics supplies the full line of Major League Electronics PCB Connectors, SIM Connectors, Terminal Blocks, MICRO, IDC Connectors, Shrouded Headers and MicroUSBs.
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Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.