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Hirose Launches Solution Partner Network to Address Changing Design Challenges
May 6, 2024 | HiroseEstimated reading time: 1 minute
Hirose, a leader in the design and manufacturing of innovative connector solutions, has established a Solution Partner Network that enables OEMs to quickly explore product design, specialty IP, and component fulfillment options that best suit their needs.
The Solution Partner Network offers OEMs a competitive advantage. OEMs can easily expand their design and manufacturing resources thru a vetted channel to ultimately improve product performance, reduce costs and improve time-to-market. From quick turn prototyping, to designing for harsh environments, to scaling for manufacturing, Hirose’s Solution Partner Network addresses intricate design problems with tailored solutions that meet unique customer needs.
The Solution Partner Network is a strategic collaboration comprising Hirose, eight premier design partners with various product development core competencies and specialty IP, and Hirose’s eight distribution partners with expertise in logistics and fulfillment. The network enables OEMs to explore Hirose’s innovative connector solutions, various subsystem solutions from Hirose’s design partners, and peace of mind in component fulfillment from a Hirose distribution partner. Connect with Hirose, and explore design, specialty IP, and logistics options through Hirose’s new Solution Partner Network.
“Through the Solution Partner Network, OEMs can tap into a wealth of expertise, resources, and collaborative opportunities that will drive success in today's rapidly evolving marketplace,” said Pete Lais, Assistance VP of Product Management at Hirose Electric USA.
Connect with Hirose to explore Hirose’s innovative connector solutions, various subsystem and specialty IP solutions from design partners, and simplified component fulfillment from a trusted Hirose distributor.
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Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
09/05/2025 | GlobalFoundriesSynopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
Kris Moyer Discusses His Emerging Design Technologies Class
09/04/2025 | Marcy LaRont, I-Connect007Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
Synopsys Announces Expanding AI Capabilities for its Leading EDA Solutions
09/04/2025 | SynopsysSynopsys announced expanding Synopsys.ai™ Copilot generative AI (GenAI) capabilities for its industry-leading semiconductor design solutions, enabling semiconductor engineering teams to accelerate development timelines, support significantly more complex designs, and increase engineering velocity amidst a workforce shortage.