Micross, Sital Announce Global Manufacturing & Distribution Partnership
May 7, 2024 | Micross Components, Inc.Estimated reading time: 2 minutes
Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions. With this collaboration, Micross is now the exclusive world-wide manufacturer, distributor, and value-services provider of Sital’s best-in-class 1553 products, including Octava, Total Octava, and integrated transceiver solutions.
Micross’ global manufacturing and product support capabilities offer streamlined supply chain options for 1553 customers worldwide. Micross is pleased to immediately introduce Sital’s OCTAVA and Total-OCTAVA products. These MIL-STD-1553 solutions provide pin-for-pin fit-form-function hardware and software compatibility with industry standard fully-integrated MIL-STD-1553 components, packaging 1553 protocol, memory, transceivers and isolation transformers in a compact BGA. Additionally, they feature the lowest transceiver power dissipation available, bus controller intrusion detection and protection (IDS/IPS) capability, and options for IRIG-106 Chapter 10 Monitor, and McAir-compatible transceivers. Micross will manufacture Sital products from its center of excellence in Apopka, Florida, supported by its geographically diverse sites providing testing and integration.
"We are thrilled to announce our partnership with Micross Components," said Ofer Hofman, Founder and CEO of Sital Technology. "For the past 20 years, our MIL-STD-1553 IP has been at the forefront of the FPGA segment, with thousands of nodes deployed worldwide across various industries. Through this collaboration with Micross, renowned for their excellence in components packaging, we can now extend the availability of our cutting-edge solutions to a broader market segment."
"Our joint efforts enable us to deliver the highest level of reliability in MIL-STD-1553 component solutions," added Hofman. "Customers who have relied on other companies dominating this segment will finally have access to the exceptional quality and performance that our solutions offer. This partnership is a game-changer for the industry. By leveraging Micross' packaging expertise and Sital Technology's proven dominance in the FPGA segment, this collaboration holds immense promise in meeting the pressing demand for reliable MIL-STD-1553 solutions.”
“We are excited to be working with Sital Technology and their industry-leading MIL-STD-1553 data bus solutions, further expanding our comprehensive portfolio of hi-reliability microelectronics for the Aerospace, Defense, and Space markets,” said Vincent Buffa, Micross Chairman and CEO. “This partnership enables Micross to provide OEMs of hi-rel systems with the most advanced, compact and power efficient 1553 technology available.”
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.