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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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Real Time with… IPC APEX EXPO 2024: Transitioning Into Automation With DIS
May 8, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Publisher Barry Matties and DIS Sales Director Jesse Ziomek discuss the company's shift toward automation, tackling issues such as limited floor space and integration costs while showcasing the advantages their SAM automation system has to offer. Also discussed are workforce challenges and return on investment considerations. As Jesse states, "DIS's goal is to offer solutions for smaller shops," and underscores the user-friendly, no-integration-costs aspect of their system.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Suggested Items
Quantum Building Blocks
03/05/2021 | ORNLOak Ridge National Laboratory scientists demonstrated that an electron microscope can be used to selectively remove carbon atoms from graphene’s atomically thin lattice and stitch transition-metal dopant atoms in their place.
With DIS, Accurate Registration is Everything
03/30/2020 | Real Time with...IPCIn this video interview from the show, Technical Editor Pete Starkey and Jesse Ziomek, VP of sales for DIS, discuss how the company achieves ultimate accuracy in layer-to-layer registration, not just in rigid multilayers, but also in flex and rigid-flex builds. Jesse also comments on keeping technology exciting enough to attract young engineers into the industry.
RTW IPC APEX EXPO: DIS Introduces Enhanced Pinless Multilayer Layup System
03/05/2018 | Real Time with...IPCDIS introduces an enhanced version of their established pinless multilayer layup system now capable of handling flex and rigid-flex constructions. Jesse Ziomek explains.
The Dawn of Gallium Oxide Microelectronics
02/09/2018 | AIP.orgSilicon has long been the go-to material in the world of microelectronics and semiconductor technology. But silicon still faces limitations, particularly with scalability for power applications. Pushing semiconductor technology to its full potential requires smaller designs at higher energy density.
Jesse Garant Metrology Center Invests $15M to Expand Part Inspection Services
08/01/2017 | Jesse Garant Metrology CenterJesse Garant Metrology Center has expanded its operations to accommodate the growing demand for high volume part inspection for pre-production and production validation. With investments in new equipment and better infrastructure, their enhanced capabilities solidify their position as leaders within the nondestructive testing and metrology part inspection services industry.