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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Real Time with… IPC APEX EXPO 2024: Transitioning Into Automation With DIS
May 8, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Publisher Barry Matties and DIS Sales Director Jesse Ziomek discuss the company's shift toward automation, tackling issues such as limited floor space and integration costs while showcasing the advantages their SAM automation system has to offer. Also discussed are workforce challenges and return on investment considerations. As Jesse states, "DIS's goal is to offer solutions for smaller shops," and underscores the user-friendly, no-integration-costs aspect of their system.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Suggested Items
Quantum Building Blocks
03/05/2021 | ORNLOak Ridge National Laboratory scientists demonstrated that an electron microscope can be used to selectively remove carbon atoms from graphene’s atomically thin lattice and stitch transition-metal dopant atoms in their place.
With DIS, Accurate Registration is Everything
03/30/2020 | Real Time with...IPCIn this video interview from the show, Technical Editor Pete Starkey and Jesse Ziomek, VP of sales for DIS, discuss how the company achieves ultimate accuracy in layer-to-layer registration, not just in rigid multilayers, but also in flex and rigid-flex builds. Jesse also comments on keeping technology exciting enough to attract young engineers into the industry.
RTW IPC APEX EXPO: DIS Introduces Enhanced Pinless Multilayer Layup System
03/05/2018 | Real Time with...IPCDIS introduces an enhanced version of their established pinless multilayer layup system now capable of handling flex and rigid-flex constructions. Jesse Ziomek explains.
The Dawn of Gallium Oxide Microelectronics
02/09/2018 | AIP.orgSilicon has long been the go-to material in the world of microelectronics and semiconductor technology. But silicon still faces limitations, particularly with scalability for power applications. Pushing semiconductor technology to its full potential requires smaller designs at higher energy density.
Jesse Garant Metrology Center Invests $15M to Expand Part Inspection Services
08/01/2017 | Jesse Garant Metrology CenterJesse Garant Metrology Center has expanded its operations to accommodate the growing demand for high volume part inspection for pre-production and production validation. With investments in new equipment and better infrastructure, their enhanced capabilities solidify their position as leaders within the nondestructive testing and metrology part inspection services industry.