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How HDI/UHDI Manufacturing Converge With Interposers and Substrates

11/17/2025 | Marcy LaRont, I-Connect007
For decades, the PCB and the semiconductor package lived in separate universes. PCBs belonged to the world of board shops, panels, and assembly lines; packages belonged to semiconductor fabs and OSATs. Substrates and interposers, meanwhile, were niche system-level package “components” in the middle, largely invisible to the outside world. That separation is dissolving as definitions broaden. The rise of high-density interconnect (HDI) and its next-generation cousin, ultra HDI (UHDI), is pushing PCB manufacturing into territory once reserved for semiconductor packaging.

Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025

11/17/2025 | Sydney Xiao, Global Electronics Association East Asia
Discussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.

Cicor Reports Strong A&D Order Momentum, Expands Global Footprint with Valtronic Site Acquisitions

11/17/2025 | Cicor
The Cicor Group has secured major new orders from Aerospace & Defence (A&D) customers bringing the year-to-date ratio of new orders to sales (book-to-bill rate) for the whole Cicor Group to 1.09 YTD October (1.04 YTD September).

MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica

11/12/2025 | MacDermid Alpha Electronics Solutions
Every advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance. 

Advanced Electronics Packaging Digest: Third Issue Arrives November 17

11/12/2025 | I-Connect007
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
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