Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
May 16, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: 1 minute
You came, you saw, and you experienced the magic of IPC APEX EXPO 2024. Now you get to relive the many memories and experiences in the pages of Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine, our annual review of everything that happened during our week in Anaheim, California.
“A special thank you to the IPC team for organizing such a powerful event,” says Barry Matties, publisher of I-Connect007. The Technical Conference was world-class, and the well-thought-out Professional Development Courses are helping many to grow in their careers. The Emerging Engineer program is growing and helping our industry become better.”
What will you find inside this issue?
- Show reviews from industry professionals who traversed the show floor, attended conference sessions, and helped to connect all the pieces that this show offers.
- A view through a photographer's lens in our many photo galleries, capturing the show floor, keynote speakers, receptions, and of course, the guests.
- Nearly 100 video interviews with industry leaders who share topics of interest, including the latest innovations and product releases from their companies.
- Interviews with many of the recipients of IPC’s annual awards, including Hall of Fame, Dieter Bergman Fellowship Award, President’s Award, Rising Star, Best Technical Paper, Best Student Poster, and committee volunteers.
- Reviews of the three keynote speakers, winners of the IPC Design Competition, a review of Factory of the Future/CFX, and standards activity.
“In the end, it took many hands to make light work,” Matties says. “So, a big thank you to all who worked to make this show valuable to the industry and help us build electronics better.”
Click here to see what's inside!
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Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
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10/30/2025 | Linda Stepanich, Community MagazineHow does a European PCB manufacturer navigate the competitive manufacturing landscape in Europe? By participating in standards development committee meetings, testifying before the European Commission on industry issues, and sponsoring hand-soldering competitions in the region. Group ACB, based in France and Belgium, focuses on high-reliability applications. The 37-year-old company is also active in the Global Electronics Association, giving credit for helping ACB to raise awareness of electronics manufacturing in Europe.
Light-curable Solutions for Reliable Electronics in Space Applications
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SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
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Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.