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IMI Posts $290 Million of Revenues for Q1 of 2024
May 10, 2024 | IMIEstimated reading time: 1 minute
Integrated Micro-Electronics, Inc. (IMI) reports group revenues of US$290 million for Q1 2024, 16% lower than the previous year, partly due to the divestment of STI which was still contributing revenues to the company last year. Cost rationalization activities have mitigated the drop in revenues to maintain IMI core operating margin at 2.4%, which sits at a similar level to 2023. Net loss for the group totaled US$3.7 million in the first quarter of 2024.
Led by the European market, IMI’s automotive segment continues its path to recovery with Q1 revenues beating the previous year by 6%. On the other hand, the industrial segment remains challenged as IMI clients are still seeing softness in their end-consumer markets. This has delayed the depletion of existing stocks in the supply chain and reduced ordering across this space for IMI. Pockets of component shortages remain for certain parts, leading to business backlogs that will be cleared as the availability of materials continues to normalize.
Effective May 1, 2024, Louis Hughes was appointed as Chief Executive Officer for IMI. “It is an honor to take on the responsibility as CEO for a great company like IMI which has ingrained such a rich culture in its employees across the globe. The deeply rooted partnerships it has forged with key customers and suppliers in the industry are a testament to the successful history the company has built over the past four decades. We have all witnessed the challenges that IMI has had to overcome these past several years, and I recognize the work that must be done to bring the company back to better profitability. Together with our new Chief Financial Officer Robert Heese, I am excited to work with the brilliant roster of talent in IMI and unitedly enact the changes necessary to bring better financial results and maximize shareholder value,” stated Hughes.
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Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.