Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Fresh PCB Concepts: PCB Plating Process Overview
ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus
May 13, 2024 | SEMIEstimated reading time: 2 minutes
The 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability. More than 120 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the May 13-16 conference in Albany, New York.
Featuring keynotes by thought leaders from IBM, Wolfspeed, and Semiconductor Advisors, ASMC 2024 is the premier event where industry professionals network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Bradley Wood, Applications Engineering Manager, CMP Filtration at Entegris, and Vijayalakshmi Seshachalam, CVD Process Manager at GlobalFoundries.
ASMC will feature the following:
- Digital Transformation for Sustainability: Empowering the Semiconductor Industry Through AI and Green Practices – The one-hour tutorial by EMD Electronics on Tuesday, May 14 will cover:
- Multifaceted environmental challenges associated with chip manufacturing
- How leveraging AI and embracing green practices can enable the industry to develop more sustainable materials, eco-friendly processes, and energy-efficient chips
- Case studies of collaborations among material suppliers, equipment manufacturers, and foundries and device makers that found great success
- Poster presentations from around the world will be on display at the Poster Session reception on the evening of May 14, covering a range of topics including:
- Yield Enhancement
- Advanced Metrology
- Advanced Equipment Processes and Materials
- Contamination-Free Manufacturing
- First Robotics Demonstration on Wednesday, May 15 – Sponsored by TEL
- The First Robotics Team from Shenendehowa High School in Clifton, N.Y. will demonstrate its competition robot and Crescendo game, a unique competition among robots to toss rings through musical hoops.
Also highlighting ASMC 2024 on Wednesday, May 15, will be the workforce development panel discussion titled Talent Pipeline: Building a Sustainable and Diverse Semiconductor Workforce. Panelists will include:
- Kylie Patterson, Senior Advisor, CHIPS for America
- Kevin Younis, COO and Executive Deputy Commissioner, Empire State Development
- Héctor M. Rodríguez, Dean of Science, Technology, Engineering and Math, Hudson Valley Community College
- Fran Dillard, Vice President and Chief Diversity Inclusion Officer, Micron
ASMC 2024 will also feature more than 20 technical sessions covering topics including:
- 3D, TSV, and Novel Advanced Silicon Processing
- Advanced Equipment Processes and Materials
- Advanced Metrology
- Advanced Process Control
- Advanced Semiconductor Technologies
- Artificial Intelligence / Machine Learning
- Big Data Management and Mining
- Contamination Free Manufacturing
- Defect Inspection
- Equipment Optimization
- Factory Automation
- Manufacturing for Sustainability
- Smart Manufacturing / Industrial Engineering
- Yield Enhancement / Yield Methodologies
The Women in Semiconductors (WiS 2024) program takes place on Thursday, May 16 in conjunction with ASMC 2024. The program will address challenges and strategies for promoting diversity and inclusion in the workplace. Complimentary registration is available for ASMC attendees.
Share on:
Suggested Items
Boeing Commits to Expand South Carolina Operations
12/20/2024 | BoeingBoeing announced it plans to expand its operations in Charleston County. The company plans to invest $1 billion in infrastructure upgrades at its existing site and create 500 new jobs over the next five years.
Cicor Publishes Nine-month Results Report due to OEP Mandatory Offer
12/20/2024 | CicorCicor Group is publishing a nine-month report today. OEP has published a mandatory offer after it converted its Mandatory Convertible Bonds (MCNs) and thereby crossed the mandatory offer threshold.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/20/2024 | Nolan Johnson, I-Connect007Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Siemens Extends Veloce Hardware-assisted Verification Support of EPGM Ethernet to 1.6 Tbps
12/18/2024 | SiemensSiemens Digital Industries Software announced today an extension of its Veloce™ hardware-assisted verification platform to support 1.6 Tbps Ethernet. As a core component of the Siemens software/hardware and system validation platform, Veloce delivers complete virtual models to support Ethernet Packet Generator and Monitor (EPGM) Ethernet port speeds up to 1.6 Tbps.