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Nolan's Notes: The Next Killer App in Component Manufacturing

05/02/2025 | Nolan Johnson -- Column: Nolan's Notes
For quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.

IPC APEX EXPO 2025: We’ve Got It Covered

04/01/2025 | I-Connect007 Editorial Team
IPC APEX EXPO is the largest electronics manufacturing trade show in North America, bringing together professionals from all sectors of the supply chain to educate, network, and share their products and services. We’ve put all our coverage of the show in one easy-to-find location. Just click on “Videos,” “Show Coverage” and “Photos” to find what you’re looking for. Check back regularly as more content is added. You won’t want to miss any of our unique coverage. 

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

02/14/2025 | Andy Shaughnessy, Design007 Magazine
Show season is upon us. Recently, Marcy LaRont and I attended DesignCon’s 30th anniversary show, and the expo floor was packed for almost the entire time. Show managers went all out, hosting a welcome party that included a rocking DJ. Much of the event revolved around AI and how to implement it. Is your company utilizing AI now? I’m featuring an abundance of articles from the past week, covering everything from DesignCon presentations to the benefits of volunteering for an IPC committee. If you’ve ever thought about joining a relevant committee, IPC is always looking for “new blood.”

SMTA Chapters: A Bold, New Direction

02/05/2025 | Nolan Johnson, SMT007 Magazine
Since joining SMTA as director of chapter relations about seven months ago, Alicia Yao has had some immediate and definite impact. Her background includes management in the luxury product retail space which, if one reflects on it, provides philosophical parallels to customer relationship building in electronics assembly.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/13/2024 | Andy Shaughnessy, I-Connect007
This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
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