-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
A Potpourri of Design PD Classes
May 14, 2024 | Kelly Dack, I-Connect007Estimated reading time: 2 minutes

What is invention without innovation? What is innovation without capability? What is capability without standards and guidelines? What are standards and guidelines without the design and manufacturing stakeholders who produce them?
Folks say that invention involves the creation of things entirely new, while innovation is the process of improving the creations or finding new ways to use them. This observation holds true in all realms of PCB design. However, PCB designers, seated at PCB design workstations with very powerful CAD tools at hand, often misunderstand the concept of invention. Like a new musician making a lead error in a blues riff will refer to off-color notes as “jazz,” many new PCB designers not checking in with supplier capabilities will consider their work an “invention.”
A mistake is a mistake. DFM is a step in the innovation process, which is a necessary part of design. If new materials or processes do not exist, applying the concept of invention involves long timelines and astronomical financial backing, which must occur in order to reach the goals of a new product concept.
On Sunday, April 7, I attended a “design for” Professional Development session taught by Dale Lee. Presented as a two-part morning and afternoon class, Dale covered some very important DFs: design for manufacture (DFM), design for reliability (DFR), and design for assembly (DFA), referred to holistically as DFX (design for excellence). Lee gave many examples that stressed the importance of following industry standards and guidelines in the design of printed boards and assemblies. He stressed the importance of becoming familiar with common materials, machinery, and processes the PCB industry uses in order to “design for” measured success needed by the industry in order to provide measurable quality, performance, and reliability.
Later that morning, I bounced over to the “Ask the Flexperts” PD sessions featuring Mark Finstad and Nick Koop from TTM. Both innovators in their own rights, this Flexpert tag team was able to cover all aspects of flex and rigid-flex design principles to not only confirm industry-proven design methodology but follow up with tangible, expert, manufacturing stakeholder responses from TTM to illustrate what designers can do to improve their future flex designs. The two generously provided all attendees with a tote ring of flex circuit reference material, which can serve as a tactile guide in determining how flex structures behave mechanically.
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Suggested Items
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies
04/03/2025 | I-Connect007 Editorial TeamDuring the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon.
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
04/03/2025 | PRNewswireAnsys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, The Designer's Guide to... More Secrets of High-Speed PCBs, features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.