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Advanced Electronics Packaging Digest

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STARTEAM GLOBAL Joins IPAI to Advance AI Innovation in PCB Manufacturing

09/16/2026 | STARTEAM GLOBAL
We are pleased to announce that STARTEAM GLOBAL has joined IPAI (Innovation Park Artificial Intelligence), one of Europe’s leading AI innovation hubs dedicated to accelerating the practical application of AI across industries.

Edge4Vets: Changing Lives Through Opportunity

09/15/2026 | Dan Beaulieu
Companies throughout the PCB, EMS, semiconductor, microelectronics, aerospace, defense, and medical electronics sectors need dependable people who can think clearly, learn quickly, solve problems, work safely, and perform as part of a team. Meanwhile, thousands of exceptionally capable military veterans are returning to civilian life with those very qualities. The challenge is bringing these two groups together, and helping each understand the other. That is the mission of Edge4Vets, founded by Tom Murphy, director of the Human Resiliency Institute at Fordham University’s Gabelli School of Business.

USI Launches AI Smart Camera Solution to Accelerate Smart Manufacturing

09/14/2026 | USI
USI announced its next-generation AI Smart Camera solution, a comprehensive edge AI and vision platform that empowers manufacturers to accelerate digital transformation through AI-driven quality inspection, process automation, logistics optimization, and smart factory initiatives

Remtec Partners With Edge4Vets to Create Career Pathways for Military Veterans in High-Tech Manufacturing

09/10/2026 | Remtec
Veteran intern Gary Colas represents the first step in Remtec’s commitment to recruiting, developing, and hiring more veterans.

HUMAIN, Compal Partner to Expand Cloud-to-Edge AI at LEAP 2026

09/01/2026 | Compal Electronics Inc.
As artificial intelligence rapidly expands beyond centralized cloud computing into real-world applications, HUMAIN has selected Compal Electronics as its long-term strategic ODM partner to support the development and manufacturing of its next-generation AI infrastructure and intelligent computing platforms.
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