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NVIDIA, Corning Partner to Boost U.S. AI Manufacturing

05/06/2026 | BUSINESS WIRE
NVIDIA and Corning Incorporated announced a multiyear commercial and technology partnership to dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure.

Roundtable: Advanced Materials

04/27/2026 | I-Connect007 Editorial Team
Driven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.

Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption

04/15/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.

Nortech Systems Launches Power over Fiber Technology Platform for EMI-Sensitive Applications

04/08/2026 | Globe Newswire
Nortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, has announced the launch of its Power over Fiber technology platform.

Molex Boosts AI Clusters with Optical Interconnects

03/19/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has unveiled a robust product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centers.
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