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ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.

Yamaha Robotics Brings Inspection Innovations for Growing Markets to electronica 2024

11/19/2024 | Yamaha Robotics SMT Section
Yamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024, demonstrating the latest AI skills and special features for applications including LED lighting, e-mobility, and mechatronics.

Data-driven Precision in PCBA Manufacturing

11/13/2024 | Julie Cliche-Dubois, Cogiscan
The intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.

SCHMID Group Opens New Branch in Asia-Pacific – SCHMID Asia Pacific

10/30/2024 | SCHMID Group
The SCHMID Group is pleased to announce the official opening of its newest division, SCHMID Asia Pacific Sdn Bhd. As of November 1, 2024, the new division will begin operations, providing comprehensive services and solutions to customers across the Asia-Pacific region.

Machine Learning Can Predict the Mechanical Properties of Polymers

10/30/2024 | ACN Newswire
Polymers such as polypropylene are fundamental materials in the modern world, found in everything from computers to cars. Because of their ubiquity, it’s vital that materials scientists know exactly how each newly developed polymer will perform under different preparation conditions.
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