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Advanced Electronics Packaging Digest

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Yamaha Robotics to Focus on Assembly and Inspection Innovations at EFX 2026 in Stuttgart

09/22/2026 | Yamaha Robotics
Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart from October 6-8, how advanced surface-mount automation helps companies grow their business and increase productivity.

Viscom to Showcase the Next Generation of AI-Powered Inspection at SMTA International 2026

08/14/2026 | Viscom Inc.
At SMTA International 2026, Viscom Inc. will present how artificial intelligence is changing the way electronics manufacturers approach automated quality inspection – from intelligent programming to increasingly autonomous inspection processes. 

Koh Young Brings Smart AI Solutions to productronica India 2026 South and Expands Regional Presence

08/06/2026 | Koh Young
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will place its Smart AI Solutions at the center of its participation in productronica India 2026 South, September 16–18 at the Bangalore International Exhibition Centre in Bengaluru.

TRI Launches TR7600 SV Series High-Throughput X-ray Inspection System

06/22/2026 | TRI
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly announces the launch of the TR7600 SV Series. The newly released line scan 3D AXI delivers up to a 20% performance improvement compared to the award-winning TR7600 SIII series.

TM Soldering Solutions Launches EmberX Selective Soldering Control Software

06/15/2026 | TM Soldering Solutions
TM Soldering Solutions introduces its powerful EmberX software control package, developed for its PHOENIX Selective Soldering platforms.
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