Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership
May 20, 2024 | High Density Packaging User GroupEstimated reading time: 1 minute
High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.
"Our mission is always to become the most reliable printed circuit board manufacturer in the world. We are focused on innovation all the time with R&D investments of about 10% year over year. Kinwong has a highly advanced Central Lab that is ISO 17025 qualified and can be used as a 3rd party lab", said Vincent Wang, the Tech. R&D Director at Kinwong. “It’s really a great honor to join HDP and I strongly believe the interaction with the HDP community will provide insights to have better understanding of cutting-edge technologies. The one chain of upstream, middle-stream and downstream linked by HDP will give all of us the full picture of the industry and accelerate innovation.”
"I am pleased to welcome Kinwong to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in PWB fabrication for high performance electronics, especially those focused on HDI for next-generation servers and networking products, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.
Share on:
Suggested Items
High Density Packaging User Group Announces Dynamic Electronics Membership
10/14/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
Real Time with… IPC APEX EXPO 2024: The HDP User Group's Role in the Electronics Industry
05/22/2024 | Real Time with...IPC APEX EXPOBev Christian, a project facilitator from the HDP User Group, outlines the consortium's focus on new materials and reliability in the electronics industry, and their collaboration on non-proprietary projects. Key areas of interest include corrosion, PFAS, and lead-free solders. Bev also highlights the value of collaboration and mentions partnerships with other consortia. The HDP User Group welcomes interested individuals to get involved via their website.
High Density Packaging User Group Announces Gold Circuit Electronics Membership
02/06/2024 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Gold Circuit Electronics (GCE) has become a member.
High Density Packaging User Group Announces Shikoku Chemicals Corporation Membership
02/02/2024 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.
HDPUG: 30 Years of Collaboration
01/01/2024 | Madan Jagernauth, Marketing Directory HDPThe High Density Packaging User Group International Inc. (HDP) and IPC have partnered successfully for many years. The groups signed an MOU in 2020 to strengthen this relationship, increase technical collaboration between the groups, and provide a mutual path toward emerging and disruptive high-density interconnect (HDI) technologies. IPC became a member of HDP at that point.