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Manu Skyttä Starts as the President and CEO of Aspocomp Group Plc
May 20, 2024 | GlobeNewswireEstimated reading time: Less than a minute
Manu Skyttä, MSc, Aeronautical Engineering, who was appointed as the new President and CEO of Aspocomp Group Plc in February, starts his position today. The Company issued a release on the appointment of Manu Skyttä on February 15, 2024.
“We are pleased with the appointment of Mr. Manu Skyttä,” says Ms. Päivi Marttila, Chairman of the Board of Directors. “Manu’s energy and his passion for change and growth, together with his wide experience from different business functions, give him strong competence to develop Aspocomp into the next phase,” adds Päivi Marttila
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10/17/2024 | Calumet ElectronicsCalumet Electronics of Michigan today announced it is pioneering organic substrate technology in the United States in collaboration with KLA Corporation, which also has a Michigan headquarters.
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10/16/2024 | I-Connect007 Editorial TeamDesign for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost.
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Marcy’s Musings: Destination Metallization
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