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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Spring 2024 Santa Clara County Flexfactor Finals Held at Nextflex
May 20, 2024 | NextFlexEstimated reading time: 1 minute
NextFlex hosts this semester’s FlexFactor. Four teams of high school students competed by pitching their inventive products to a panel of esteemed judges composed of Robert de Neve, General Partner & Chief Strategist General Partner & Chief Strategist at NextPhase Ventures; Christine Holly Ngo, VP of Operations and Business Development at Silicon Valley Elite Manufacturing, Inc; and Jackson Rambough, FHE Design and Process Engineer at NextFlex.
The first of the four inspiration products was a drone that, equipped with pesticides, analyzes what individual crops need spraying and delivers targeted bursts to only those plants, reducing the amount of pesticides released into the environment, saving valuable money and time for the farmers, and eliminating unnecessary intervention for healthy plants.
The second product was a lightweight, unobtrusive, and nearly invisible patch that scans the wearer for potential blood clots and signs of an impending stroke.
The third product was a backpack that takes inspiration from the animal kingdom, designed to function like a desert beetle that collects water from its surroundings. The wearable shell, designed for areas with low access to fresh water or disaster zones, pulls water from vapor around it and stores it in the pack, purifying it before it is consumed.
The final project was a fish-shaped robot that monitors pH levels, water temperature, and nutrient concentrations in hydroponic farms to help facilitate adoption of a farming style that is more environmentally-friendly and space-efficient.
Suggested Items
I-Connect007 Observes U.S. Independence Day Holiday
07/04/2025 | Nolan Johnson, I-Connect007Today marks the 248th anniversary of the signing of the American Declaration of Independence by the Continental Congress. Known widely in the U.S. as Independence Day or “The Fourth of July,” this day also commemorates the declaration by the Congress that the American colonies are free and independent states.
MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
06/16/2025 | MRSI Systems, LLCMRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People’s Court for infringement of MRSI Systems’ patent related to die bonder (Case No. (2025) YUE03minchu No. 7154).
Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
06/06/2025 | Fraunhofer IPMSA pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch of the GENESIS project.
Zhen Ding Promotes Digital Transformation and Embraces AI Business Opportunities
06/06/2025 | Zhen Ding TechnologyOn May 27, 2025, General Manager Chen-Fu Chien of Zhen Ding Technology Group was invited to attend the "2025 Two Thousand Forum" held by The CommonWealth Magazine.
IMI Signs Share Purchase Agreement to Sell Its Czech Republic Manufacturing Site
06/06/2025 | IMIIntegrated Micro-Electronics Inc (IMI), through its wholly-owned subsidiary, Coöperatief IMI Europe U.A., has signed a share purchase agreement to sell 100% of the shares in IMI Czech Republic (IMI CZ) to KEBODA Deutschland GmbH & Co. KG, a subsidiary of Keboda Technology Co., Ltd. (Keboda), a publicly listed company in China.