Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Flexible Thinking: PCB Designers Still Wanted
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBsListen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers
May 24, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.
In “PCB 3.0: A New Design Methodology—More Power to the EE,” we continue the theme of bringing more decision-making power to the design process. This time, we're discussing how to bring more "power" (and "signal”) to the electrical engineer with our guest, Supreeth Mannava, Cadence Design Systems.
What should manufacturers know? What does this mean for EEs and the new generation of designers? Listen to find out!
I-Connect007 is dedicated to providing our audience with a wide range of digital content and information to help them succeed in the industry. From magazines, books, and newsletters to market reports, podcasts, and event coverage, we deliver digital content that meets the needs of our community.
I-Connect007 is the longest-running digital media company in the industry and a leading publisher of original, exclusive content for the global electronics supply chain.
Listen now to Episodes 1-5 of PCB 3.0: A New Design Methodology.
Share on:
Suggested Items
Altair Announces Material Collaboration with HP
06/25/2024 | AltairThe collaboration will help break down traditional barriers to 3D printing adoption and ultimately help customers better design parts for Multi Jet Fusion and Metal Jet printers.
Siemens, Intel Foundry Collaborate to Deliver New Tools Certifications and EMIB/3D-IC Innovation
06/25/2024 | Siemens Digital IndustriesSiemens Digital Industries Software announced that its ongoing collaboration with Intel Foundry has established a new Electronic Design Automation (EDA) product certification, as well as an embedded multi-die interconnect bridge (EMIB) enablement breakthrough that can help mutual customers leverage the performance, space and power efficiency advantages of 3D-IC (3D integrated circuit) designs much more quickly.
Cadence, Intel Foundry Collaborate on Systems Foundry Enablement for the AI Era
06/25/2024 | Cadence Design Systems, Inc.Cadence Design Systems, Inc. announced the achievement of several key milestones in its ongoing strategic partnership with Intel Foundry.
Siemens Introduces Innovator3D IC - a Comprehensive Multiphysics Cockpit for 3D IC Design, Verification and Manufacturing
06/24/2024 | SiemensSiemens Digital Industries Software announced today Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates in the world.
Foxconn Expands into New Energy with Strategic JV and Launches New Charging Solutions
06/21/2024 | FoxconnFoxconn Interconnect Technology, a subsidiary of Hon Hai, is expanding its presence in the electric vehicle (EV) sector.