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American Standard Circuits/ASC Sunstone Circuits Showcase Cutting-edge Technology at PCB East 2024
May 21, 2024 | American Standard CircuitsEstimated reading time: 1 minute
American Standard Circuits (ASC) and ASC Sunstone Circuits are excited to announce their participation in PCB East 2024, a premier event for the printed circuit board and electronics design industry. The event will take place from June 4-6, 2024, at the Boxboro Regency Hotel and Conference Center in Boxborough, MA.
Visitors to the ASC Sunstone booth will have access to educational resources and physical samples showcasing the company's various PCB technologies. Experts from ASC Sunstone will be available to answer technical questions and provide guidance on selecting the best solutions for PCB quoting and ordering.
“We are thrilled to exhibit at PCB East 2024 and engage with the PCB community,” said Matt Stevenson, VP/General Manager of ASC Sunstone. “This event provides an excellent platform to share our latest advancements and connect with industry leaders and customers.”
Join Us at PCB East 2024
American Standard/Sunstone Circuits invites all attendees to visit booth 202 for an in-depth look at their products and to discuss how ASC Sunstone can meet the needs of their PCB projects. Whether you are a designer, engineer, or PCB enthusiast, ASC Sunstone promises to offer valuable insights and exciting advancements in technology.
In addition to the exhibit, ASC Sunstone is proud to announce that Anaya Vardya, CEO of American Standard Circuits, will be a member of the UHDI Forum at PCB East 2024. This forum promises to provide valuable insights into the latest advancements and applications of UHDI in the PCB industry. For more details or to register for the event, visit pcbeast.com.
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09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
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The Marketing Minute: Cracking the Code of Technical Marketing
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EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.