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Bridging the Gap: Re-engaging Design and Manufacturing with Downstream

06/27/2024 | Andy Shaughnessy, Design007 Magazine
At PCB East in Boxborough, Massachusetts, I caught up with Joe Clark, co-founder of DownStream Technologies. In this interview, Joe walks us through how we got into our current situation, with design, fab, and assembly functioning in separate silos, and how DownStream and the IPC-2581 data format can help bridge this gap. He also discusses what we lost by moving from the captive model, and what we stand to gain by knocking down the walls between design and manufacturing.

IPC K-FEST Set to be IPC’s Landmark Event in Korea

06/27/2024 | IPC
IPC K-FEST is set to be IPC’s landmark event in Korea on Oct 29, 2024, bringing together industry peers to celebrate the advancements and contributions that have shaped the landscape of electronics standards and technology.

For Networking, Edge, and IoT Applications: Swissbit Expands PCIe Portfolio

06/27/2024 | Swissbit
Storage specialist Swissbit continues to strategically expand its PCIe offerings. The new N2000 (Gen3 PCIe) and N3000 (Gen4 PCIe) product families primarily address applications that require PCIe performance as well as a balanced ratio of low power consumption and reduced heat generation.

IDC Reveals Automotive Semiconductor Market Outlook and Discusses Technological Advancements

06/26/2024 | IDC
A recent IDC report, Worldwide Automotive Semiconductor Market Forecast, 2024 categorizes automotive chips into distinct segments: analog chips, logic chips, microprocessors, memory chips, discrete devices, optoelectronic devices, and sensors.

CSPs to Expand into Edge AI, Driving Average NB DRAM Capacity Growth by at Least 7% in 2025

06/26/2024 | TrendForce
TrendForce has observed that in 2024, major CSPs such as Microsoft, Google, Meta, and AWS will continue to be the primary buyers of high-end AI servers, which are crucial for LLM and AI modeling.
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