Smart Automation: The Journey of a Component Through an SMT Factory
Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 22, 2024 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
Well, we’re officially entering the silly season, i.e., the holidays. Where did the year go? I still have money left on the Starbuck’s gift card I received last Christmas.
In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Meet Polar's New Engineer Jess Hollenbaugh
Published November 21
Jess Hollenbaugh recently joined Polar Instruments, and she was nice enough to sit down for an interview at PCB West. How did a physics major with a love of thermodynamics wind up in the signal integrity software business? It’s great to see young people coming into our segment again, but we need a few thousand more just like Jess.
Advanced Packaging: Preparation is Now
Published November 20
IPC has just released a white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” written by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer for IPC. This paper fleshes out IPC’s silicon-to-systems concept, and Matt and Devan offer our industry a way forward as we face more complex advance packaging challenges.
Global Citizenship: What I’ve Learned About the American PCB Business
Published November 20
Did you ever wonder what our industry looks like to technologists from other countries? After all, we can be a hot mess, but we still manage to lead the way. And as columnist Tom Yang says, the U.S. PCB industry tends to “double down on innovation.” Check it out.
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Published November 20
Dan Beaulieu writes a weekly column for us, as well as the occasional book review. I’m a big fan of Malcolm Gladwell (Are you a “connector,” a “maven,” or a “salesman”?), so I’ll have to check out Revenge of the Tipping Point: Overstories, Superspreaders, and the Rise of Social Engineering. If you haven’t already done so, read The Tipping Point and Outliers too.
PCB Carolina’s Formula: Industry Experts and Catered Food
Published November 18
Does the food selection at a trade show have any influence on our decision to attend said show? It does for me. I’ve attended PCB Carolina since 2016, and the catered food is always one of the high points of the event. This time we had barbecued brisket for lunch. It’s no wonder PCB Carolina keeps growing every year.
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EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates
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Women in Technology: Learning to Just Be Myself
04/21/2026 | Michelle Te, I-Connect007Approximately 100 women and a handful of men gathered for a Women in Electronics evening event at APEX EXPO. As I wandered among the tables before it started, I stopped to chat with several women all wearing purple and white polo shirts emblazoned with the TTM logo. It turns out they are part of TTM’s Women in Technology Group, so I sat down and invited them to share their thoughts on coming to the event and what it means to be part of the electronics industry.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.