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New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability

05/18/2026 | I-Connect007
I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.

LITEON Joins DJBIC Indices and Top 1% in S&P Sustainability Yearbook 2026

05/11/2026 | LITEON Technology
LITEON Technology announced that it recorded an ESG score of 91 in the S&P Global 2025 Corporate Sustainability Assessment (CSA), representing its best performance to date since joining the Dow Jones Best‑in‑Class Indices (DJBIC, formerly DJSI) framework in 2010 and marking its 15th consecutive year of inclusion.

Delta Electronics Thailand Named to Dow Jones Best-in-Class Indices for Fifth Straight Year

05/11/2026 | Delta Electronics
Delta Electronics (Thailand) Public Company Limited, a global leader in power management and smart green solutions has been included in the Dow Jones Best-in-Class Indices (DJ BIC, formerly DJSI) for the fifth consecutive year since 2021.

Zhen Ding Becomes Taiwan’s Only PCB Company Listed in Both DJ BIC Indices

05/06/2026 | Zhen Ding
S&P Dow Jones Indices recently announced the annual rebalancing results of the Dow Jones Bestin-Class Indices (DJ BIC).

From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation

05/06/2026 | I-Connect007
I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
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