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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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An AI Revolution in Wire Harness Manufacturing
May 24, 2024 | Brittany Martin, IPC/WHMAEstimated reading time: 1 minute
In the wire harness industry, a narrative unfolds that is as intricate and interconnected as its products. Arik Vrobel’s journey from El-Com Systems to the founding of Cableteque is one of enduring innovation, strategic adaptation, and a deep understanding of the industry’s evolving needs. His development of an AI application for the wire harness industry may be a game-changer for manufacturers.
Since its inception in 1961, El-Com Systems has specialized in the design and manufacture of wire harnesses and cable assemblies. The Vrobel family acquired El-Com Systems (then known as El-Com/cabletek) in 1988, when Elie Vrobel (Arik’s father), an unemployed engineer, was seeking to fulfill his “American Dream” by becoming an entrepreneur. However, it was a difficult transition as Elie was unfamiliar with the business and El-Com was in a challenging industry. Arik worked alongside his father to understand the company and the industry. His involvement was characterized by a commitment to the values and vision established by his father.
When Arik took over the leadership of El-Com, he established a forward-thinking approach that significantly transformed the company. He says his vision for El-Com Systems “involved continuing its tradition of excellence and driving it toward new technological frontiers and market expansions.”
He assumed leadership of the company in the early 2000s, with strategic decisions that expanded El-Com's capabilities and market reach, particularly in sectors demanding high reliability, like aerospace, defense, and medical. “I was known for seeking simplified, yet effective solutions to technical challenges,” he says of that time, and his leadership was characterized by a drive to increase the company's capacity and scale.
To read the rest of this article in the Spring 2024 issue of IPC Community, click here.
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Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
When Quality Is Personal: The Human Stakes Behind Electronics Reliability
05/06/2026 | Kelly DackIn electronics manufacturing, quality is often discussed in terms of specifications, standards, and process controls, but as industry veteran Doug Pauls reminds us, the stakes are far more human. In this conversation, Doug, a recipient of the Global Electronics Association’s Hall of Fame Award, draws on more than four decades of experience to illuminate the real-world consequences of reliability, where even a single defect can carry profound implications. He brings into sharp focus why quality isn’t just a metric, but a responsibility shared by everyone on the manufacturing floor.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.
Vern Solberg: A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.