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Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers
May 23, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.
In “PCB 3.0: A New Design Methodology—More Power to the EE,” we continue the theme of bringing more decision-making power to the design process. This time, we're discussing how to bring more "power" (and "signal”) to the electrical engineer with our guest, Supreeth Mannava, Cadence Design Systems.
What should manufacturers know? What does this mean for EEs and the new generation of designers? Listen to find out!
I-Connect007 is dedicated to providing our audience with a wide range of digital content and information to help them succeed in the industry. From magazines, books, and newsletters to market reports, podcasts, and event coverage, we deliver digital content that meets the needs of our community.
I-Connect007 is the longest-running digital media company in the industry and a leading publisher of original, exclusive content for the global electronics supply chain.
Listen now to Episodes 1-5 of PCB 3.0: A New Design Methodology.
Suggested Items
Looking For That Perfect Job? Check Out jobCONNECT007
07/25/2024 | I-Connect007 Editorial TeamThere are a lot of open positions in this industry today. But where do you begin to look? We have the answer: jobCONNECT007, your guide to career opportunities in the electronic industry. In jobCONNECT007, you’ll find job openings that span the entire circuit board supply chain. Whether you’re involved in design, fabrication, assembly, test, or material development or distribution, this handy resource can help you get on your way to a new gig.
Strip Etch Strip: Episode 9 of On the Line With... Designing for Reality Podcast Now Available
07/25/2024 | I-Connect007Don't miss the latest episode of "On the Line With... Designing for Reality," where we walk through the PCB manufacturing process. At this stage, we have a panel made up of all the internal layers laminated together, through-holes drilled, and the outer layer copper features covered with a protective layer of tin.
Ventec Giga Solutions & Hi-Print Team up to Launch World's First 3-Color Inkjet Printing Solution
07/24/2024 | Ventec International GroupVentec Giga Solutions, Ventec’s value-added PCB equipment division, and leading inkjet printer manufacturer Hi-Print have teamed up to launch the industry’s most cutting-edge inkjet printer for solder mask technology.
Ian Walsh Appointed as Sondrel’s Regional VP for America
07/23/2024 | SondrellSondrel, a leading provider of ultra-complex, custom chips for leading global technology brands, has appointed Ian Walsh as its Regional VP for America, with the responsibility of growing Sondrel’s US semiconductor business from its new Silicon Valley offices in Santa Clara, CA.
LG Accelerates Smart Factory Solutions Business Integrating AI with 66-year Manufacturing Expertise
07/23/2024 | LGLG Electronics is advancing its smart factory solutions business by integrating artificial intelligence (AI) and digital transformation (DX) with its extensive 66-year history of manufacturing and production expertise.