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Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
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Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers
May 23, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.
In “PCB 3.0: A New Design Methodology—More Power to the EE,” we continue the theme of bringing more decision-making power to the design process. This time, we're discussing how to bring more "power" (and "signal”) to the electrical engineer with our guest, Supreeth Mannava, Cadence Design Systems.
What should manufacturers know? What does this mean for EEs and the new generation of designers? Listen to find out!
I-Connect007 is dedicated to providing our audience with a wide range of digital content and information to help them succeed in the industry. From magazines, books, and newsletters to market reports, podcasts, and event coverage, we deliver digital content that meets the needs of our community.
I-Connect007 is the longest-running digital media company in the industry and a leading publisher of original, exclusive content for the global electronics supply chain.
Listen now to Episodes 1-5 of PCB 3.0: A New Design Methodology.
Suggested Items
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Shaughnessy Report: Breaking Down the Language Barrier
03/11/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportAccording to Ethnologue’s 2024 update, there are currently 7,164 living languages being spoken today. It makes you wonder: Do they count PCB design as a language? PCB fabrication? Assembly?