I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 24, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes

Recently, I was reading a report from Deloitte on the Mexican economy (and don’t judge me what I read while I wait my turn at the gym). This particular report is cited in an interview scheduled for the June 2024 issue of SMT007 Magazine. I made note of a few things.
The construction of industrial facilities in the country has grown 19% in the first six months of 2023, compared to the same period last year. Factories within Mexican border can affix the “Made in Mexico” label on their goods and pay zero duty on a large number of products exported into the U.S. Since March 2022, Mexico is now the largest commercial partner of the United States, passing China.
The authors are quite clear in their conclusions: “Mexico is a manufacturing country, and more importantly, it is a reassembler. It imports intermediate goods that it transforms into semifinal or final products, which are then largely exported. This phenomenon is quite significant in Mexican commerce, as manufacturing exports represent almost 90% of total exports, while non-oil intermediate imports represent 70% of total imports.”
We’ll be looking at the changing EMS landscape in the upcoming issue of SMT007 Magazine, and the dynamics in Mexico make for a great case study. That issue will publish in early June. Until then, here are my picks for the top news items of the past week, all of which report on fundamental shifts to the landscape of our industry.
DuPont Announces Plan to Separate into Three Independent, Publicly Traded Companies
Published May 23
DuPont announced a plan to separate into three distinct, publicly traded companies. New DuPont will be a premier diversified industrial company powered by deep materials science and application engineering expertise, industry-leading innovation, top-tier manufacturing capabilities, and iconic brands such as Tyvek®, Kevlar® and Nomex®. New DuPont will have a strong presence in fast-growing healthcare end-markets including applications for biopharma consumables, medical devices, and medical packaging. As independent entities, both Electronics and Water will benefit from increased focus and agility in their respective industries. At separation, each of the three companies will have strong balance sheets, attractive financial profiles and compelling growth opportunities.
Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC
Published May 21
As IPC's new chief strategist of advanced packaging, Devan Iyer shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies. This is one to keep an eye on as IPC leads the conversation on this topic.
Scalable ZLD and a Solution for PCB Start-ups
Published May 23
Alex Stepinski continues to share his innovative thinking and design insights in developing manufacturing processes that deliver on ecological sustainability goals. In this interview, Stepinski discusses his Zero Liquid Discharge systems, and his concerns for the global PCB fabrication industry. You can always count on Alex to keep the industry moving forward.
China Retains Market Advantage in Battery Development Despite U.S. Raising Tariffs on Chinese Battery Imports to 25%
Published May 23
Trendforce reports that in the short term, increased tariffs and IRA regulations underscore the growing geopolitical influence on the EV industry. U.S. automakers can mitigate these impacts by partnering with established battery makers from Japan and South Korea or investing in solid-state battery technology. In the long term, scaling up EV sales to achieve economies of scale is crucial for reducing battery costs.
IBM to Acquire Octo
Published May 20
IBM announced an agreement to acquire Octo, a U.S.-based IT modernization and digital transformation services provider exclusively serving the U.S. federal government, including defense, health, and civilian agencies. IBM's acquisition of Octo establishes one of the largest digital transformation partners to the federal government. This acquisition speaks to the increased strategic importance of data management and digital transformation to all industry, not solely electronics manufacturing.
Suggested Items
Intel Appoints Lip-Bu Tan as Chief Executive Officer
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IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
03/13/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announces the retirement of Tom Forsythe, Executive Vice President, effective December 31, 2024, after more than three decades of service to the company and the electronics manufacturing industry.
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
03/13/2025 | Technica USATechnica USA, a leading provider of materials, equipment, installation, and services for the printed circuit board (PCB) fabrication, PCB Assembly, substrates, MEMS, and semiconductor industries, proudly announces its 40th anniversary in 2025.
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.