-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 24, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes

Recently, I was reading a report from Deloitte on the Mexican economy (and don’t judge me what I read while I wait my turn at the gym). This particular report is cited in an interview scheduled for the June 2024 issue of SMT007 Magazine. I made note of a few things.
The construction of industrial facilities in the country has grown 19% in the first six months of 2023, compared to the same period last year. Factories within Mexican border can affix the “Made in Mexico” label on their goods and pay zero duty on a large number of products exported into the U.S. Since March 2022, Mexico is now the largest commercial partner of the United States, passing China.
The authors are quite clear in their conclusions: “Mexico is a manufacturing country, and more importantly, it is a reassembler. It imports intermediate goods that it transforms into semifinal or final products, which are then largely exported. This phenomenon is quite significant in Mexican commerce, as manufacturing exports represent almost 90% of total exports, while non-oil intermediate imports represent 70% of total imports.”
We’ll be looking at the changing EMS landscape in the upcoming issue of SMT007 Magazine, and the dynamics in Mexico make for a great case study. That issue will publish in early June. Until then, here are my picks for the top news items of the past week, all of which report on fundamental shifts to the landscape of our industry.
DuPont Announces Plan to Separate into Three Independent, Publicly Traded Companies
Published May 23
DuPont announced a plan to separate into three distinct, publicly traded companies. New DuPont will be a premier diversified industrial company powered by deep materials science and application engineering expertise, industry-leading innovation, top-tier manufacturing capabilities, and iconic brands such as Tyvek®, Kevlar® and Nomex®. New DuPont will have a strong presence in fast-growing healthcare end-markets including applications for biopharma consumables, medical devices, and medical packaging. As independent entities, both Electronics and Water will benefit from increased focus and agility in their respective industries. At separation, each of the three companies will have strong balance sheets, attractive financial profiles and compelling growth opportunities.
Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC
Published May 21
As IPC's new chief strategist of advanced packaging, Devan Iyer shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies. This is one to keep an eye on as IPC leads the conversation on this topic.
Scalable ZLD and a Solution for PCB Start-ups
Published May 23
Alex Stepinski continues to share his innovative thinking and design insights in developing manufacturing processes that deliver on ecological sustainability goals. In this interview, Stepinski discusses his Zero Liquid Discharge systems, and his concerns for the global PCB fabrication industry. You can always count on Alex to keep the industry moving forward.
China Retains Market Advantage in Battery Development Despite U.S. Raising Tariffs on Chinese Battery Imports to 25%
Published May 23
Trendforce reports that in the short term, increased tariffs and IRA regulations underscore the growing geopolitical influence on the EV industry. U.S. automakers can mitigate these impacts by partnering with established battery makers from Japan and South Korea or investing in solid-state battery technology. In the long term, scaling up EV sales to achieve economies of scale is crucial for reducing battery costs.
IBM to Acquire Octo
Published May 20
IBM announced an agreement to acquire Octo, a U.S.-based IT modernization and digital transformation services provider exclusively serving the U.S. federal government, including defense, health, and civilian agencies. IBM's acquisition of Octo establishes one of the largest digital transformation partners to the federal government. This acquisition speaks to the increased strategic importance of data management and digital transformation to all industry, not solely electronics manufacturing.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.