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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Sustainability is a Key Driver in Printed Electronics
May 28, 2024 | OE-AEstimated reading time: 1 minute
drupa 2024 takes place from May 28 to June 07 in Düsseldorf, Germany. Dr. Klaus Hecker, Managing Director of OE-A, a Working Group within VDMA, speaks about the drupa show and its significance for the printed electronics industry:
- “drupa is a great opportunity for the printed electronics industry to come together with the graphic printing industry on one platform. We expect drupa to highlight a range of innovative solutions and the latest sustainable printing methods and practices. Sustainability is a driving force in many industries, including printing and packaging. We believe that printed electronics plays a crucial role, when it comes to more sustainable packaging solutions.”
- “The global packaging market is expected to grow in the coming years, also driven by the continued growth of e-commerce. The integration of printed electronics will enable smart packaging. Smart packaging supports logistic processes, protects against counterfeiting, and can monitor temperature, humidity, or mechanical stress. It enables active wireless communication and IoT applications by printed NFC and RFID tags.”
- “Printed electronics provides the toolbox for a wide range of applications including smart packaging: sensors, batteries, lighting, energy harvesting – produced with environmentally friendly and resource-saving processes using sustainable materials and substrates.”
Suggested Items
Results of the AT&S Annual General Meeting: Andy Mattes appointed Chairman of the Supervisory Board
07/04/2025 | AT&SAndy Mattes was newly elected to the Supervisory Board of AT&S Austria Technologie und Systemtechnik Aktiengesellschaft and is appointed until the 36th Annual General Meeting 2030. Georg Hansis was re-elected.
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Summit Interconnect Participates in PCBAA Annual Meeting to Advance U.S. Electronics Policy
06/26/2025 | Summit Interconnect, Inc.Summit Interconnect was proud to participate in the 2025 Annual Meeting of the Printed Circuit Board Association of America (PCBAA), held in Washington, D.C. this June.