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Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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Sustainability is a Key Driver in Printed Electronics
May 28, 2024 | OE-AEstimated reading time: 1 minute
drupa 2024 takes place from May 28 to June 07 in Düsseldorf, Germany. Dr. Klaus Hecker, Managing Director of OE-A, a Working Group within VDMA, speaks about the drupa show and its significance for the printed electronics industry:
- “drupa is a great opportunity for the printed electronics industry to come together with the graphic printing industry on one platform. We expect drupa to highlight a range of innovative solutions and the latest sustainable printing methods and practices. Sustainability is a driving force in many industries, including printing and packaging. We believe that printed electronics plays a crucial role, when it comes to more sustainable packaging solutions.”
- “The global packaging market is expected to grow in the coming years, also driven by the continued growth of e-commerce. The integration of printed electronics will enable smart packaging. Smart packaging supports logistic processes, protects against counterfeiting, and can monitor temperature, humidity, or mechanical stress. It enables active wireless communication and IoT applications by printed NFC and RFID tags.”
- “Printed electronics provides the toolbox for a wide range of applications including smart packaging: sensors, batteries, lighting, energy harvesting – produced with environmentally friendly and resource-saving processes using sustainable materials and substrates.”
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Ibiden Opens Ono Plant to Expand AI Server IC Substrate Production Capacity
10/14/2025 | IBIDENIBIDEN Co., Ltd. announces that it held the opening ceremony for its Ono Plant on October 10, 2025 in Ono Town, Ibi District, Gifu Prefecture. Construction work and preparations for mass production at the plant had been underway.
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Zhen Ding Holding Posts September 2025 Monthly Revenue Report
10/10/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported September 2025 revenue of NT$19,362 million, up 32.15% MoM and up 0.13% YoY, marking the second-highest level for the same period in company history.
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.