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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Real Time with… IPC APEX EXPO 2024: Advanced Technologies with BlueRing Stencils
May 28, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Guest Editor Kelly Dack and Greg Smith, manager of stencil technology with BlueRing Stencils, discuss the company's capabilities and services. They explore the use of nano coatings for thin stencils and determining the area ratio. Greg emphasizes the role of stencil artwork in controlling solder deposition and the need for collaboration between designers and stencil companies. They also focus on thinner stencils and step stenciling techniques for achieving proper solder deposition.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Suggested Items
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
KYZEN to Spotlight Stencil Cleaning Solutions at SMTA Oregon
05/02/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Oregon Expo & Tech Forum, scheduled to take place on Tuesday, May 20 at the Wingspan Event and Conference Center in Hillsboro, OR. KYZEN’s cleaning expert Jeff Deering will be on-site at the expo providing information about stencil cleaning chemistries, including KYZEN E5631J.
KYZEN Focuses on Aqueous Cleaning and Stencil Cleaning at SMTA Wisconsin
04/24/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Wisconsin Expo and Tech Forum, scheduled to take place Tuesday, May 6 at the Crowne Plaza Milwaukee Airport. KYZEN will be on-site to provide attendees with information about aqueous cleaning chemistry AQUANOX A4618 and stencil cleaner KYZEN E5631J.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.