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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Merlin Flex Invests in New Techwin Solder Mask Developer
May 31, 2024 | Merlin Flex LtdEstimated reading time: Less than a minute
Merlin Flex Continue their investment programme with the installation & commissioning of a new Techwin Solder Mask Developer. This new machine allows faster & more accurate developing in the solder mask process.
The machine further enhances our drive to a cleaner & better working environment for our employees.
Merlin Flex is currently installing more new and additional equipment as part of its current investment programme.
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Compunetics Advances PCB Manufacturing with MicroCraft’s Dual-Ink CraftPix Inkjet Printer
09/30/2025 | MicroCraftMicroCraft, a global leader in advanced PCB testing and digital inkjet printing systems, has completed the installation of its CraftPix C2K6151PT dual-ink inkjet printer at Compunetics, Inc., a premier flex and rigid printed circuit board manufacturer located just outside Pittsburgh, Pennsylvania.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.